Graceful Register Clustering and Rebanking for Power and Timing Balancing

Authors: Hsieh, Y., Lin, T., Chang, Y., Wu, H., Jiang, I.H.

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 44(3):1070-1083 Mar, 2025

Exploring Switching Behavior of Dual-Gate RF GaN HEMTs: Characterization and Modeling

Authors: Nazir, M.S., Dwivedi, P., Pampori, A., Hsieh, Y., Chou, M., Singh Chauhan, Y.

Source: IEEE Microwave and Wireless Technology Letters IEEE Microw. Wireless Tech. Lett. Microwave and Wireless Technology Letters, IEEE. 35(2):221-224 Feb, 2025

Underwater Image Enhancement and Attenuation Restoration Based on Depth and Backscatter Estimation

Authors: Hsieh, Y., Chang, M.

Source: IEEE Transactions on Computational Imaging IEEE Trans. Comput. Imaging Computational Imaging, IEEE Transactions on. 11:321-332 2025

Enhancing the Resilience of IEC 61131–3 Software With Online Reconfigurations for Fault Handling

Authors: Wilch, J., Vogel-Heuser, B., Sax, F., Ruth, S., Oeckl, U., Wohlschlager, B., Hsieh, Y., Cheng, F.

Source: IEEE Transactions on Automation Science and Engineering IEEE Trans. Automat. Sci. Eng. Automation Science and Engineering, IEEE Transactions on. 22:12436-12454 2025

Advanced Circuit Design and Implementation of a Highly Digitalized Third-Order VCO-Based Sigma-Delta Modulator With Enhanced Noise Transfer Function

Authors: Lee, S., Hsieh, Y., Chen, J.

Source: IEEE Access Access, IEEE. 13:12515-12526 2025

Development of an Alarm Pattern Detection Scheme for Managing Alarm Floods in Bumping Process

Authors: Hsieh, Y., Chen, P., Wilch, J., Vogel-Heuser, B., Chen, C., Ng, I.

Source: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 10(1):335-342 Jan, 2025

AIoT-Based Shrimp Larvae Counting System Using Scaled Multilayer Feature Fusion Network

Authors: Hsieh, Y., Hsieh, J., Hu, W., Tseng, Y.

Source: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 11(22):36438-36451 Nov, 2024

A 73.8k-Inference/mJ SVM Learning Accelerator for Brain Pattern Recognition

Authors: Tong, T., Chen, T., Hsieh, Y., Yang, C.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 59(10):3357-3365 Oct, 2024

Partial Fluctuation Power Control of Resonant Converter in Solid-State Transformer

Authors: Li, Z., Zhao, C., Hsieh, Y., Li, Q., Lee, F.C.

Source: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(10):12358-12367 Oct, 2024

Developing the Keep-Important-Samples Scheme for Training the Advanced CNN-Based Automatic Virtual Metrology Models

Authors: Hsieh, Y., Liu, C., Huang, S., Li, C., Wilch, J., Vogel-Heuser, B., Cheng, F., Chen, C.

Source: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(9):7931-7938 Sep, 2024

Enhancing Detection of Falls and Bed-Falls Using a Depth Sensor and Convolutional Neural Network

Authors: Su, M., Chen, J., Hsieh, Y., Hsu, S., Liao, C.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(14):23150-23162 Jul, 2024

Low-Voltage Quadrature Voltage-Controlled-Oscillator Using Twisted Transformer

Authors: Jang, S., Hsieh, Y., Juang, M., Sung, J., Lai, W.

Source: IEEE Microwave and Wireless Technology Letters IEEE Microw. Wireless Tech. Lett. Microwave and Wireless Technology Letters, IEEE. 34(6):667-670 Jun, 2024

High-Density Embedded 3-D Stackable Via RRAM in 16-nm FinFET CMOS Logic Process

Authors: Huang, Y., Hsieh, Y., Lin, Y., Chih, Y., Wang, Y., Chang, J., King, Y., Lin, C.J.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(6):3614-3619 Jun, 2024

Design and Analysis of a High Linearity Full Ka-Band Stacked-FET Power Amplifier Using 0.15-µm GaAs pHEMT Process

Authors: Hsieh, Y., Lin, G., Tsai, Z., Chen, T.

Source: IEEE Microwave and Wireless Technology Letters IEEE Microw. Wireless Tech. Lett. Microwave and Wireless Technology Letters, IEEE. 34(4):427-430 Apr, 2024

An Off-Chip Capacitance Biosensor Based on Improved Cole–Cole Model for the Detection of Trimethylamine N-Oxide in Early Cardiovascular Disease

Authors: Lin, W., Lo, C., Cheng, M., Zeng, R., Hsieh, Y., Hou, P., Yeh, C., Hsieh, C., Chang, M., Liao, C.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(7):11515-11526 Apr, 2024

A Direct Current-Sensing VCO-Based 2nd-Order Continuous-Time Sigma-Delta Modulator for Biosensor Readout Applications

Authors: Lee, S., Hsieh, Y., Lee, H., Chang, S., Chen, J.

Source: IEEE Transactions on Biomedical Circuits and Systems IEEE Trans. Biomed. Circuits Syst. Biomedical Circuits and Systems, IEEE Transactions on. 18(2):288-298 Apr, 2024

Delanalty Minimization With Reinforcement Learning in UAV-Aided Mobile Network

Authors: Tseng, F., Hsieh, Y.

Source: IEEE Transactions on Computational Social Systems IEEE Trans. Comput. Soc. Syst. Computational Social Systems, IEEE Transactions on. 11(2):1991-2001 Apr, 2024

A Video Surveillance System for Determining the Sexual Maturity of Cobia

Authors: Hsieh, Y., Meng, Y.

Source: IEEE Transactions on Consumer Electronics IEEE Trans. Consumer Electron. Consumer Electronics, IEEE Transactions on. 70(1):484-495 Feb, 2024

Analysis of Oplegnathus Punctatus Body Parameters Using Underwater Stereo Vision

Authors: Hsieh, Y., Lee, P.

Source: IEEE Transactions on Emerging Topics in Computational Intelligence IEEE Trans. Emerg. Top. Comput. Intell. Emerging Topics in Computational Intelligence, IEEE Transactions on. 8(1):879-891 Feb, 2024

Design and Implementation of Modulated Ultrasonic Transducer Based on an Empirically Physical-Based Carotid Model for Assessing Carotid Artery Stenosis

Authors: Hsieh, C., Hou, P., Hsieh, Y., Lin, W., Liao, C.

Source: IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 7(12):1-4 Dec, 2023