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1Conference
Authors: He, Huanyu, Yang, Liying, Du, Jingtao, Hai, Qinyu, Tian, Yang, Fu, Jiulin
Source: 2024 IEEE International Conference on Bioinformatics and Biomedicine (BIBM) Bioinformatics and Biomedicine (BIBM), 2024 IEEE International Conference on. :4164-4171 Dec, 2024
Relation: 2024 IEEE International Conference on Bioinformatics and Biomedicine (BIBM)
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2Conference
Authors: Du, Jingtao, Yang, Liying, He, Huanyu, Tian, Yang, Wang, Qiang, Fu, Jiulin
Source: 2024 IEEE International Conference on Bioinformatics and Biomedicine (BIBM) Bioinformatics and Biomedicine (BIBM), 2024 IEEE International Conference on. :5683-5690 Dec, 2024
Relation: 2024 IEEE International Conference on Bioinformatics and Biomedicine (BIBM)
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3Report
Authors: Chen, Tieyuan, Liu, Huabin, Wang, Yi, Chen, Yihang, He, Tianyao, Gan, Chaofan, He, Huanyu, Lin, Weiyao
Subject Terms: Computer Science - Computer Vision and Pattern Recognition
Access URL: http://arxiv.org/abs/2501.07227
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4Conference
Authors: Cao, Gang, Yang, Liying, Tang, Chengchuang, Zhang, Qian, He, Huanyu
Source: 2023 IEEE International Conference on Bioinformatics and Biomedicine (BIBM) Bioinformatics and Biomedicine (BIBM), 2023 IEEE International Conference on. :4792-4799 Dec, 2023
Relation: 2023 IEEE International Conference on Bioinformatics and Biomedicine (BIBM)
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5Conference
Authors: Zhang, Ge, He, Huanyu, Wang, Haiyang, Lin, Weiyao
Source: 2022 IEEE International Conference on Multimedia and Expo Workshops (ICMEW) Multimedia and Expo Workshops (ICMEW), 2022 IEEE International Conference on. :1-6 Jul, 2022
Relation: 2022 IEEE International Conference on Multimedia and Expo Workshops (ICMEW)
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6Conference
Authors: Qin, Ziran, He, Huanyu, Lin, Weiyao
Source: 2022 IEEE International Conference on Multimedia and Expo Workshops (ICMEW) Multimedia and Expo Workshops (ICMEW), 2022 IEEE International Conference on. :1-6 Jul, 2022
Relation: 2022 IEEE International Conference on Multimedia and Expo Workshops (ICMEW)
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7Conference
Authors: Sang, Hanbo, Ni, Zelin, He, Huanyu, Gao, Xuesong, Sun, Qihao, Qu, Lei, Zhang, Sihai, Wang, Wenwen, Aramvith, Supavadee, Lin, Weiyao
Source: 2022 IEEE International Conference on Multimedia and Expo (ICME) Multimedia and Expo (ICME), 2022 IEEE International Conference on. :1-6 Jul, 2022
Relation: 2022 IEEE International Conference on Multimedia and Expo (ICME)
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8Conference
Authors: Zhang, Yuang, He, Huanyu, Li, Jianguo, Li, Yuxi, See, John, Lin, Weiyao
Source: 2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) CVPR Computer Vision and Pattern Recognition (CVPR), 2021 IEEE/CVF Conference on. :11617-11626 Jun, 2021
Relation: 2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)
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9Conference
Authors: Chu, Lei, He, Huanyu, Pei, Ling, Yu, Wenxian, Qiu, Robert Caiming
Source: 2020 IEEE 20th International Conference on Communication Technology (ICCT) Communication Technology (ICCT), 2020 IEEE 20th International Conference on. :157-162 Oct, 2020
Relation: 2020 IEEE 20th International Conference on Communication Technology (ICCT)
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10Conference
Authors: He, Huanyu, Chu, Lei, Qiu, Robert Caiming
Source: 2019 IEEE/CIC International Conference on Communications in China (ICCC) Communications in China (ICCC), 2019 IEEE/CIC International Conference on. :636-640 Aug, 2019
Relation: 2019 IEEE/CIC International Conference on Communications in China (ICCC)
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11Periodical
Authors: Liu, Congcong, Lu, Qiongqiong, Gorbunov, Mikhail V., Omar, Ahmad, Gonzalez Martinez, Ignacio G., Zhao, Panpan, Hantusch, Martin, Dimas Chandra Permana, Antonius, He, Huanyu, Gaponik, Nikolai, Mikhailova, Daria
Source: Journal of energy chemistry. 79:373-381
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12Conference
Authors: Wang, Shiwei, Ding, Yingtao, He, Huanyu, Lu, Jian-Qiang
Source: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :79-82 May, 2015
Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)
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13Conference
Authors: He, Huanyu, Gu, Xiaoxiong, Lu, Jian-Qiang
Source: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :548-553 May, 2014
Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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14Conference
Authors: He, Huanyu, Lu, James J.-Q., Gu, Xiaoxiong
Source: 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI. :67-72 May, 2014
Relation: 2014 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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15Academic Journal
Authors: He, Huanyu, Liu, Hongling, Guo, Yang, Li, Yang, Li, Peng, Zhang, Hua, Hu, Taotao, Ni, Hongwei
Source: In Journal of Materials Research and Technology November-December 2022 21:2663-2671
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16Academic Journal
Authors: He, Huanyu1 (AUTHOR) hehuanyu_ee@sjtu.edu.cn, Lin, Weiyao1 (AUTHOR) wylin@sjtu.edu.cn, Zhang, Yuang1 (AUTHOR) zyayoung@sjtu.edu.cn, He, Tianyao1 (AUTHOR) hetianyao@sjtu.edu.cn, Li, Yuxi1 (AUTHOR) lyxok1@126.com, Li, Jianguo2 (AUTHOR) jglee@outlook.com
Source: International Journal of Computer Vision. Feb2025, Vol. 133 Issue 2, p867-889. 23p.
Subject Terms: *MAXIMUM likelihood detection, *MAXIMUM likelihood statistics, *LATENT variables, *AUTOENCODER, *DETECTORS, *PEDESTRIANS
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17Conference
Authors: He, Huanyu, Xu, Zheng, Gu, Xiaoxiong, Lu, Jian-Qiang
Source: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1115-1121 May, 2013
Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)
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18Conference
Authors: He, Huanyu, Lu, James J.-Q., Xu, Zheng, Gu, Xiaoxiong
Source: ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI. :70-74 May, 2013
Relation: 2013 24th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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19Academic Journal
Authors: Liu, Hongling, He, Huanyu, Li, Yang, Hu, Taotao, Ni, Hongwei, Zhang, Hua
Source: In Construction and Building Materials 5 July 2021 290
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20Periodical
Authors: He, Huanyu, Hou, Weiwei, Liu, Hongling, Li, Yang
Source: Guo cheng gong cheng xue bao. 19(4):735-741