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    Academic Journal

    Authors: Hu, Wen1,2, Shao, Chongyun2,3, Yu, Chunlei2, Deng, Lu2, Ming, Yuzhou3,4, Ye, Qing2,3, Li, Xin2, Liu, Yinpeng2, Wei, Mengda2, He, Dongyu2, Hu, Lili2, Li, Si-Yu1, lisiyu@hnu.edu.cn, Pan, Anlian1,5, anlian.pan@hnu.edu.cn, Liao, Meisong2, liaomeisong@siom.ac.cn

    Source: Journal of Applied Physics; 1/14/2025, Vol. 137 Issue 2, p1-11, 11p

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    Conference

    Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-6 Aug, 2020

    Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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    Conference

    Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-6 Aug, 2020

    Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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    Conference

    Source: 2019 IEEE 10th International Conference on Mechanical and Aerospace Engineering (ICMAE) Mechanical and Aerospace Engineering (ICMAE), 2019 IEEE 10th International Conference on. :133-136 Jul, 2019

    Relation: 2019 IEEE 10th International Conference on Mechanical and Aerospace Engineering (ICMAE)

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    Academic Journal

    Authors: Song, Jiaxin1 (AUTHOR), He, Dongyu2 (AUTHOR), Guo, Weiling2 (AUTHOR), Huang, Yanfei2 (AUTHOR), Li, Zhixiong1,3 (AUTHOR), Wang, Haidou2,4 (AUTHOR) whaidou2021@163.com, Xing, Zhiguo2 (AUTHOR) xingzg2011@163.com

    Source: Journal of Thermal Spray Technology. Aug2023, Vol. 32 Issue 6, p1637-1651. 15p.

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