A novel Design for Improving Heat Dissipation Capacity of Single-Phase Immersion Cooling System with the Perturbation Mechamism

Authors: Hsu, Po-Chien, Wu, Jiahong, Kuo, Chia-Lung, Chen, Carrie, Zhang, Jun, Lo, Ying-Shan, Haung, Po-Tsang

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-5 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)