Toward all-MOCVD grown InAs/GaAs quantum dot laser diode on a Si substrate for O-band telecommunication

Authors: Kim, HoSung, Park, Honghwi, Geum, Dae-Myeong, Lee, Seungchul, Ko, Young-Ho, Ahn, Joon Tae, Kim, Kap-Joong, Kim, Duk-Jun, Han, Won Seok

Source: 2024 IEEE Silicon Photonics Conference (SiPhotonics) Silicon Photonics Conference (SiPhotonics), 2024 IEEE. :1-3 Apr, 2024

Relation: 2024 IEEE Silicon Photonics Conference (SiPhotonics)

Thermal Management in Multi-Finger GaN-on-Si HEMTs: Understanding and Mitigating Self-Heating and Thermal Crosstalk for Enhanced Device Reliability

Authors: Jeong, Jaeyong, Choi, Sung Joon, Shim, Joonsup, Kim, Eunjung, Kim, Seong Kwang, Kim, Bong Ho, Kim, Joon Pyo, Suh, Yoon-Je, Beak, Woo Jin, Geum, Dae-Myeong, Koh, Yumin, Kim, Donghyun, Kim, SangHyeon

Source: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

IL Scavenging and Recovery Strategies to Improve the Performance and Reliability of HZO-Based FeFETs

Authors: Kim, Bong Ho, Kim, Seong Kwang, Kuk, Song-hyeon, Suh, Yoon-Je, Jeong, Jaeyong, Kim, Joon Pyo, Geum, Dae-Myeong, Kim, Sanghyeon

Source: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

Fully CMOS-Compatible Room-Temperature Waveguide-Integrated Bolometer Based on Germanium-on-Insulator Platform at Mid-Infrared Operating Beyond 4 μm

Authors: Shim, Joonsup, Lim, Jinha, Kim, Inki, Kim, Seong Kwang, Ahn, Seung-Yeop, Park, Juhyuk, Jeong, Jaeyong, Kim, Bong Ho, Lee, Seunghyeon, An, Jihwan, Geum, Dae-Myeong, Kim, SangHyeon

Source: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

Room-temperature waveguide-integrated photodetector using bolometric effect for mid-infrared spectroscopy applications

Authors: Shim, Joonsup, Lim, Jinha, Kim, Inki, Jeong, Jaeyong, Kim, Bong Ho, Kim, Seong Kwang, Geum, Dae-Myeong, Kim, SangHyeon

Subject Terms: Physics - Optics, Physics - Applied Physics

Access URL: http://arxiv.org/abs/2405.14155

3D Stackable Broadband Photoresponsive InGaAs Biristor Neuron for a Neuromorphic Visual System with Near 1 V Operation

Authors: Han, Joon-Kyu, Sim, Jaeho, Geum, Dae-Myeong, Kim, Seong Kwang, Yu, Ji-Man, Kim, Jongmin, Kim, Sanghyeon, Choi, Yang-Kyu

Source: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :1-4 Dec, 2021

Relation: 2021 IEEE International Electron Devices Meeting (IEDM)

Heat management in monolithic 3D RF platform

Authors: Jeong, Jaeyong, Kim, Seong Kwang, Kim, Jongmin, Geum, Dae-Myeong, Kim, SangHyeon

Source: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :79-81 Mar, 2022

Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

Ge-based Mid-infrared integrated photonics platform for Sensing

Authors: Kim, Sanghyeon, Lim, Jinha, Shim, Joonsup, Geum, Dae-Myeong

Source: 2022 Device Research Conference (DRC) Device Research Conference (DRC), 2022. :1-2 Jun, 2022

Relation: 2022 Device Research Conference (DRC)

A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%)

Authors: Geum, Dae-Myeong, Lim, Jinha, Jang, Junho, Ahn, Seungyeop, Kim, SeongKwang, Shim, Joonsup, Kim, Bong Ho, Park, Juhyuk, Baek, Woo Jin, Jeong, Jaeyong, Kim, Sanghyeon

Source: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :413-414 Jun, 2022

Relation: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing systems

Authors: Jeong, Jaeyong, Kwang Kim, Seong, Kim, Jongmin, Geum, Dae-Myeong, Lee, Jisung, Park, Seung-Young, Kim, Sanghyeon

Source: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :328-329 Jun, 2022

Relation: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

Monolithic 3D sequential integration realizing 1600-PPI red micro-LED display on Si CMOS driver IC

Authors: Park, Juhyuk, Geum, Dae-Myeong, Baek, Woojin, Shieh, Johnson, Kim, Sanghyeon

Source: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :383-384 Jun, 2022

Relation: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

Biochemical spectroscopy based on germanium-on-insulator platform for mid-infrared optical sensor

Authors: Lim, Jinha, Shim, Joonsup, Kim, Inki, Kim, Seong Kwang, Lim, Hyeongrak, Ahn, Seung-Yeop, Park, Juhyuk, Geum, Dae-Myeong, Kim, SangHyeon

Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :24.1.1-24.1.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

3D Stackable Cryogenic InGaAs HEMT-Based DC and RF Multiplexer/Demultiplexer for Large-Scale Quantum Computing

Authors: Jeong, Jaeyong, Kim, Seong Kwang, Kim, Jongmin, Lee, Jisung, Kim, Joon Pyo, Kim, Bong Ho, Suh, Yoon-Je, Geum, Dae-Myeong, Park, Seung-Young, Kim, SangHyeon

Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :4.5.1-4.5.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

Grating – Resonance InGaAs Narrowband Photodetector for Multispectral Detection in NIR – SWIR Region

Authors: Jang, Junho, Shim, Joonsup, Lim, Jinha, Park, Gyeong Cheol, Kim, Jongmin, Geum, Dae-Myeong, Kim, SangHyeon

Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :19.4.1-19.4.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

Enhanced resistive switching behaviors of organic resistive random access memory devices by adding polyethyleneimine interlayer

Authors: Rahmani, Mehr Khalid, Khan, Sobia Ali, Geum, Dae-Myeong, Jeon, Hyuntak, Park, Seong Yeon, Yun, Changhun, Kang, Moon Hee

Source: In Organic Electronics September 2024 132

High electron mobility in metamorphic epitaxial InAs0.7Sb0.3 compound and its p-i-n photodetector

Authors: Kang, Sooseok, Roh, Il-Pyo, Kim, Sang Hyeon, Kang, Moon Hee, Geum, Dae-Myeong, Song, Jin Dong

Source: In Journal of Alloys and Compounds 25 June 2024 989

High-temperature and continuous wave-operation of all-MOCVD grown InAs/GaAs quantum dot laser diodes with highly strained layer and low temperature p-AlGaAs cladding layer

Authors: Kim, HoSung, Lee, Seungchul, Ko, Young-Ho, Ahn, Joon Tae, Kim, Kap-Joong, Kim, Duk-Jun, Geum, Dae-Myeong, Han, Won Seok

Source: In Journal of Alloys and Compounds 5 May 2024 983

High-performance InGaAs-On-Insulator HEMTs on Si CMOS for Substrate Coupling Noise-free Monolithic 3D Mixed-Signal IC

Authors: Jeong, Jaeyong, Kim, Seong Kwang, Kim, Jongmin, Geum, Dae-Myeong, Park, Juyeong, Jang, Jae-Hyung, Kim, SangHyeon

Source: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

Monolithic 3D Integrated InGaAs HEMTs on Si for Next-Generation Communication: Record $f_{\text{MAX}}$ and Relaxed Self-Heating of Top Devices by a Novel M3D Structure

Authors: Jeong, Jaeyong, Kim, Seong Kwang, Kim, Jongmin, Geum, Dae-Myeong, Kim, SangHyeon

Source: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :11.2.1-11.2.4 Dec, 2021

Relation: 2021 IEEE International Electron Devices Meeting (IEDM)

TiOx/Ti/TiOx Film-based Waveguide Bolometric Detector for On-Chip Si Photonic Sensors

Authors: Shim, Joonsup, Lim, Jinha, Geum, Dae-Myeong, You, Jong-Bum, Yoon, Hyeonho, Kim, Joon Pyo, Baek, Woo Jin, Han, Jae-Hoon, Kim, SangHyeon

Source: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :9.1.1-9.1.4 Dec, 2021

Relation: 2021 IEEE International Electron Devices Meeting (IEDM)