Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

Authors: How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien

Source: IEEE Photonics Journal, Vol 9, Iss 3, Pp 1-10 (2017)

Subject Terms: Flip chip, interposer, micro-electro-mechanical system (MEMS) packaging, optical switches, silicon photonics., Applied optics. Photonics, TA1501-1820, Optics. Light, QC350-467

File Description: electronic resource

Relation: https://ieeexplore.ieee.org/document/7927713/; https://doaj.org/toc/1943-0655

Access URL: https://doaj.org/article/d5b595b388f54f15959c152b3684ebdb