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1Academic Journal
Authors: How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien
Source: IEEE Photonics Journal, Vol 9, Iss 3, Pp 1-10 (2017)
Subject Terms: Flip chip, interposer, micro-electro-mechanical system (MEMS) packaging, optical switches, silicon photonics., Applied optics. Photonics, TA1501-1820, Optics. Light, QC350-467
File Description: electronic resource