A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors

Authors: Jouve, A., Lagoutte, E., Crochemore, R., Mauguen, G., Flahaut, T., Dubarry, C., Balan, V., Fournel, F., Bourjot, E., Servant, F., Scannell, M., Rohracher, K., Bodner, T., Faes, A., Hofrichter, J.

Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :201-209 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

A Robust Fluorescence Multiplex Immunoassay Biosensor Designed for Field Applications

Authors: Schultz, E., Perraut, F., Flahaut, T., Planat-Chretien, A., Galland, R., Lesbre, F., Hoang, A., Boutal, H., Volland, H.

Source: TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International. :955-958 Jun, 2007

Relation: TRANSDUCERS 2007 - International Solid-State Sensors, Actuators and Microsystems Conference

A novel fluorescence-based array biosensor: Principle and application to DNA hybridization assays

Authors: Schultz, E., Galland, R., Du Bouetiez, D., Flahaut, T., Planat-Chretien, A., Lesbre, F., Hoang, A., Volland, H., Perraut, F.

Source: BIOSENSORS AND BIOELECTRONICS. 23(7):987-994

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN223131761&indx=1&recIds=ETOCRN223131761