Cu/SiO2 hybrid bonding: Finite element modeling and experimental characterization

Authors: Sart, C., Estevez, R., Fiori, V., Lhostis, S., Deloffre, E., Parry, G., Gonella, R.

Source: 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-7 Sep, 2016

Relation: 2016 6th Electronic System-Integration Technology Conference (ESTC)

Effect of the temperature on the strain distribution induced in silicon interposer by TSVs: A comparison between micro-Laue and monochromatic nanodiffraction

Authors: Vianne, B., Krauss, C., Escoubas, S., Richard, M.-I., Labaf, S., Chahine, G., Schullli, T., Micha, J.-S., Fiori, V., Farcy, A., Thomas, O.

Source: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :59-62 May, 2015

Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Thermal correlation between measurements and FEM simulations in 3D ICs

Authors: Souare, P. M., de Crecy, F., Fiori, V., Ben Jamaa, H., Farcy, A., Gallois-Garreignot, S., Borbely, A., Colonna, J.-P., Coudrain, P., Giraud, B., Laviron, C., Cheramy, S., Tavernier, C., Michailos, J.

Source: 2013 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2013 IEEE International. :1-6 Oct, 2013

Relation: 2013 IEEE International 3D Systems Integration Conference (3DIC)

Chip/package interactions on advanced flip-chip packages: Mechanical investigations on copper pillar bumping

Authors: Gallois-Garreignot, S., Fiori, V., Moutin, C., Tavernier, C.

Source: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-6 Sep, 2012

Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)

Mechanical issues induced by Electrical Wafer Sort: Correlations from actual tests, nanoindentation and 3D dynamic modeling

Authors: Roucou, R., Fiori, V., Inal, K., Jaouen, H.

Source: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-6 Sep, 2010

Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)

Evaluation of probing process parameters and PAD designs: Experiments and modelling correlations for solving mechanical issues

Authors: Roucou, R., Fiori, V., Cacho, F., Inal, K., Boddaert, X.

Source: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on. :1-6 Apr, 2010

Relation: 2010 11th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Reliability Issues in Cu/low-k Structures Regarding the Initiation of Stress-Voiding or Crack Failure

Authors: Orain, S., Fuchsmann, A., Fiori, V., Federspiel, X.

Source: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on. :1-6 2006

Relation: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

Design rules to avoid tunnel cracking in VLSI interconnects during process flow

Authors: Brillet, H., Orain, S., Fiori, V., Dupeux, M., Braccini, M.

Source: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :248-253 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

A multi scale finite element methodology to evaluate wire bond pad architectures

Authors: Fiori, V., Orain, S.

Source: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :648-655 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Strain Distribution Induced in SOI Photonic Substrate by Through Silicon via Using Advanced Scanning X-Ray Nano-Diffraction

Authors: Escoubas, S., Vianne, B., Richard, M., Farcy, A., Fiori, V., Thomas, O.

Source: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 18(4):529-533 Dec, 2018

Investigation of Pattern Effects in Rapid Thermal Processing Technology: Modeling and Experimental Results

Authors: Cacho, F., Bono, H., Beneyton, R., Dumont, B., Bianchini, R., Colin, A., Fiori, V., Morin, P.

Source: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 23(2):303-310 May, 2010

Method for Managing the Stress Due to the Strained Nitride Capping Layer in MOS Transistors

Authors: Orain, S., Fiori, V., Villanueva, D., Dray, A., Ortolland, C.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 54(4):814-821 Apr, 2007

Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types

Authors: Goldberg, C., Downey, S., Fiori, V., Fox, R., Hess, K., Hinsinger, O., Humbert, A., Jacquemin, J.-P., Lee, S., Lhuillier, J.-B., Orain, S., Pozder, S., Proenca, L., Quercia, F., Sabouret, E., Tu Anh Tran, Uehling, T.

Source: Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. Interconnect technology Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International. :3-5 2005

Relation: Proceedings of the IEEE 2005 International Interconnect Technology Conference

Thin films interfacial adhesion characterization by Cross-Sectional Nanoindentation: Application to pad structures

Authors: Gallois-Garreignot, S., Chave, F., Gonchond, J.P., Gautheron, B., Fiori, V., Nelias, D.

Source: 2009 11th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. :947-952 Dec, 2009

Relation: 2009 11th Electronics Packaging Technology Conference (EPTC)

Electromigration induced failure mechanism: Multiphysics model and correlation with experiments

Authors: Cacho, F., Fiori, V., Doyen, L., Chappaz, C., Tavernier, C., Jaouen, H.

Source: EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. :1-6 Apr, 2008

Relation: 2008 Intl. Conf. on Thermal, Mechanical & Multi-Physics simulation and Experiments in Microelectronics

Study of Probing Test for Electrical Wafer Sort Application: Dynamical Simulation and Experimental Measurement

Authors: Cacho, F., Vettori, R., Galbiati, G., Thiery, G., Fiori, V., Ainaoui, M., Delpech, P., Tavernier, C., Jaouen

Source: 2007 9th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th. :391-395 Dec, 2007

Relation: 2007 9th Electronics Packaging Technology Conference

Optimization of Cu Low-k bond pad designs to improve mechanical robustness using the Area Release Energy method

Authors: Engelen, R. A. B., van der Sluis, O., van Silfhout, R. B. R., van Driel, W.D., Fiori, V.

Source: 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on. :1-4 Apr, 2007

Relation: 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems

New challenges and opportunities for 3D integrations

Authors: Michailos, J., Coudrain, P., Farcy, A., Hotellier, N., Cheramy, S., Lhostis, S., Deloffre, E., Sanchez, Y., Jouve, A., Guyader, F., Saugier, E., Fiori, V., Vivet, P., Vinet, M., Fenouillet-Beranger, C., Casset, F., Batude, P., Breuf, F., Henrion, Y., Vianne, B., Collin, L.-M., Colonna, J.-P., Benaissa, L., Brunet, L., Prieto, R., Velard, R., Ponthenier, F.

Source: 2015 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2015 IEEE International. :8.5.1-8.5.4 Dec, 2015

Relation: 2015 IEEE International Electron Devices Meeting (IEDM)

Stress management strategy to limit die curvature during silicon interposer integration

Authors: Vianne, B., Farcy, A., Fiori, V., Chappaz, C., Chevrier, N., Lobascio, G., Chausse, P., Ponthenier, F., Ruckly, A., Escoubas, S., Thomas, O.

Source: 2015 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2015 International. :TS11.4.1-TS11.4.7 Aug, 2015

Relation: 2015 International 3D Systems Integration Conference (3DIC)

Ultra-Thin Fully Depleted SOI Devices with Thin BOX, Ground Plane and Strained Liner Booster

Authors: Gallon, C., Fenouillet-Beranger, C., Vandooren, A., Boeuf, F., Monfray, S., Payet, F., Orain, S., Fiori, V., Salvetti, F., Loubet, N., Charbuillet, C., Toffoli, A., Allain, F., Romanjek, K., Cayrefourcq, I., Ghyselen, B., Mazure, C., Delille, D., Judong, F., Perrot, C., Hopstaken, M., Scheblin, P., Rivallin, P., Brevard, L., Faynot, O., Cristoloveanu, S., Skotnicki, T.

Source: 2006 IEEE international SOI Conferencee Proceedings International SOI Conference, 2006 IEEE. :17-18 Oct, 2006

Relation: 2006 IEEE international SOI Conferencee Proceedings