Co-packaged optics (CPO): status, challenges, and solutions

Authors: Min Tan, Jiang Xu, Siyang Liu, Junbo Feng, Hua Zhang, Chaonan Yao, Shixi Chen, Hangyu Guo, Gengshi Han, Zhanhao Wen, Bao Chen, Yu He, Xuqiang Zheng, Da Ming, Yaowen Tu, Qiang Fu, Nan Qi, Dan Li, Li Geng, Song Wen, Fenghe Yang, Huimin He, Fengman Liu, Haiyun Xue, Yuhang Wang, Ciyuan Qiu, Guangcan Mi, Yanbo Li, Tianhai Chang, Mingche Lai, Luo Zhang, Qinfen Hao, Mengyuan Qin

Source: Frontiers of Optoelectronics, Vol 16, Iss 1, Pp 1-40 (2023)

Subject Terms: Co-packaged optics, Silicon photonics, High-performance computing, Advanced packaging, External laser, Optical power delivery, Applied optics. Photonics, TA1501-1820

File Description: electronic resource

Relation: https://doaj.org/toc/2095-2767

Access URL: https://doaj.org/article/9529bc90f9b94b018291e0d3dc8bad29

High-Bandwidth Lumped Mach-Zehnder Modulators Based on Thin-Film Lithium Niobate

Authors: Peng Yang, Siwei Sun, Yuqiang Zhang, Rui Cao, Huimin He, Haiyun Xue, Fengman Liu

Source: Photonics, Vol 11, Iss 5, p 399 (2024)

Subject Terms: lumped, Mach-Zehnder modulators, lithium niobate, capacitively−loaded lumped electrodes, Applied optics. Photonics, TA1501-1820

File Description: electronic resource

Relation: https://www.mdpi.com/2304-6732/11/5/399; https://doaj.org/toc/2304-6732

Access URL: https://doaj.org/article/4a9837e6d85e451385de8e7946924b83

The high‐efficiency co‐design and the measurement verification of high‐bandwidth silicon photonic microring modulator

Authors: Yue Wu, Huimin He, Rui Cao, Fengman Liu

Source: IET Optoelectronics, Vol 16, Iss 6, Pp 257-265 (2022)

Subject Terms: doping profile, electro‐optical bandwidth, extinction ratio, microring modulator, Qfactor, transmitter, Applied optics. Photonics, TA1501-1820

File Description: electronic resource

Relation: https://doaj.org/toc/1751-8768; https://doaj.org/toc/1751-8776

Access URL: https://doaj.org/article/a662a55c45a142e793a4d9318eb13d8e

Six-Degree-of-Freedom Posture Measurement Technologies Using Position Sensitive Detectors (PSDs): State of the Art

Authors: Xiangxu Meng, Siwei Sun, Xuetao Yan, Fengman Liu, Liqiang Cao, Qidong Wang, Yu Sun

Source: Micromachines, Vol 13, Iss 11, p 1903 (2022)

Subject Terms: 6-DOF posture measurement, position sensitive detector, large-scale equipment assembly, ultra-precision manufacturing, Mechanical engineering and machinery, TJ1-1570

File Description: electronic resource

Relation: https://www.mdpi.com/2072-666X/13/11/1903; https://doaj.org/toc/2072-666X

Access URL: https://doaj.org/article/00553c7a624744409ae0c74edbcb6273

Novel Low-Loss Fiber-Chip Edge Coupler for Coupling Standard Single Mode Fibers to Silicon Photonic Wire Waveguides

Authors: Siwei Sun, Ying Chen, Yu Sun, Fengman Liu, Liqiang Cao

Source: Photonics, Vol 8, Iss 3, p 79 (2021)

Subject Terms: fiber-to-chip, silicon photonics, optical interconnects, edge coupler, Applied optics. Photonics, TA1501-1820

File Description: electronic resource

Relation: https://www.mdpi.com/2304-6732/8/3/79; https://doaj.org/toc/2304-6732

Access URL: https://doaj.org/article/98a8be87010f443c994c351318b14b35

Design optimization and performance verification of multi-channel high-speed optical transceiver package

Authors: Fengman Liu, Lixi Wan, Jing Zhou, Baoxia Li, Tianmin Du, Wei Gao, Fei Wan

Source: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :153-157 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

Optimization of broadband characterization for pluggable parallel optical transceiver modules on multilayer substrates

Authors: Baoxia Li, Wei Gao, Fengman Liu, Haifei Xiang, Jing Zhou, Jun Li, Zhihua Li, Jian Song, Lixi Wan

Source: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :834-838 Aug, 2010

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging

Authors: Haifei Xiang, Jian Song, Fengman liu, Wei Gao, Li, Baoxia, Lixi Wan

Source: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :1158-1161 Aug, 2010

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

12-channel board-level multi-GHz optical link using cross-switch chips and optoelectronic multi-chip package modules

Authors: Fengman Liu, Zhihua Li, Wei Gao, Haifei Xiang, Jian Song, Baoxia Li, Lixi Wan

Source: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :587-589 Aug, 2010

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Crosstalk analysis and optimization of high-speed interconnections.

Authors: Haidong Wang, Jian Song, Fengman Liu, Haifei Xiang, Wei Gao, Lixi Wan

Source: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2011, p1-4, 4p

A new measurement method and electrical design for high density optoelectronics integration.

Authors: Fengman Liu, Baoxia Li, Yunyan Zhou, Wei Gao, Haifei Xiang, Haidong Wang, Jian Song, Zhihua Li, Kun Yang, Jun Li, Liqiang Cao, Lixi Wan

Source: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2011, p1-4, 4p

Signal integrity design and validation for multi-GHz differential channels in SiP packaging system with eye diagram parameters.

Authors: Wei Gao, Lixi Wan, Shuhua Liu, Liqiang Cao, Guidotti, D., Jun Li, Zhihua Li, Baoxia Li, Yunyan Zhou, Fengman Liu, Qidong Wang, Jian Song, Haifei Xiang, Jing Zhou, Xu Zhang, Feng Chen

Source: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p607-611, 5p