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1Academic Journal
Authors: Wiegand, P., Simmich, S., Ilgaz, F., Faupel, F., Spetzler, B., Rieger, R.
Source: IEEE Open Journal of Circuits and Systems IEEE Open J. Circuits Syst. Circuits and Systems, IEEE Open Journal of. 5:398-407 2024
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2Academic Journal
Authors: Durdaut, P., Rubiola, E., Friedt, J., Muller, C., Spetzler, B., Kirchhof, C., Meyners, D., Quandt, E., Faupel, F., McCord, J., Knochel, R., Hoft, M.
Source: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 29(5):1347-1361 Oct, 2020
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3Academic Journal
Authors: Durdaut, P., Reermann, J., Zabel, S., Kirchhof, C., Quandt, E., Faupel, F., Schmidt, G., Knochel, R., Hoft, M.
Source: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 66(10):2771-2779 Oct, 2017
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4Conference
Authors: Lupan, C., Lupan, O., Terasa, M. I., Drewes, J., Polonskyi, O., Faupel, F., Adelung, R., Hansen, S., Viana, B., Pauporté, Th.
Source: Proceedings of SPIE, the International Society for Optical Engineering. 12422:124220P-124220P-6
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5Conference
Authors: Gronenberg, O., Carstens, N., Vahl, A., Faupel, F., Kienle, L.
Source: IFMBE proceedings. 77:71-74
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6Conference
Authors: Pannemann, C., Diekmann, T., Hilleringmann, U., Schurmann, U., Scharnberg, M., Zaporojtchenko, V., Adelung, R., Faupel, F.
Source: Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on. :63-66 2005
Relation: 2005 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
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7Report
Authors: Abraham, J. W., Strunskus, T., Faupel, F., Bonitz, M.
Source: J. Appl. Phys. 119, 185301 (2016)
Subject Terms: Condensed Matter - Materials Science
Access URL: http://arxiv.org/abs/1602.06265
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8Report
Authors: Rosenthal, L., Greve, H., Zaporojtchenko, V., Strunskus, T., Faupel, F., Bonitz, M.
Source: Journal of Applied Physics 114 (4), 044305 (2013)
Subject Terms: Condensed Matter - Materials Science, Physics - Plasma Physics
Access URL: http://arxiv.org/abs/1302.2595
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9Conference
Authors: Chakravadhanula, V.S.K., Mishra, Y.K., Kotnur, V.G., Hrkac, T., Kienle, L., Avasthi, D.K., Fink, D., Zaporotchenko, V., Faupel, F.
Source: CLEO/Europe - EQEC 2009 - European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference Lasers and Electro-Optics 2009 and the European Quantum Electronics Conference. CLEO Europe - EQEC 2009. European Conference on. :1-1 Jun, 2009
Relation: 2009 Conference on Lasers & Electro-Optics Europe & 11th European Quantum Electronics Conference (CLEO/EQEC)
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10Conference
Authors: Wunderle, B., Dermitzaki, E., Holck, O., Bauer, J., Walter, H., Shaik, Q., Ratzke, K., Faupel, F., Michel, B., Reichl, H.
Source: 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :1404-1413 May, 2009
Relation: 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)
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11Conference
Authors: Wunderle, B., Dermitzaki, E., Holck, O., Bauer, J., Walter, H., Shaik, Q., Ratzke, K., Faupel, F., Michel, B.
Source: EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on. :1-11 Apr, 2009
Relation: 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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12Report
Authors: Rosenthal, L., Filinov, A., Bonitz, M., Zaporojtchenko, V., Faupel, F.
Source: Contrib. Plasma Phys. 51, 971-980 (2011)
Subject Terms: Physics - Plasma Physics, Condensed Matter - Materials Science
Access URL: http://arxiv.org/abs/1106.3719
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13Academic Journal
Authors: Schurmann, U., Gerber, A., Kulkarni, A., Hettstedt, F., Zaporojtchenko, V., Knochel, R., Faupel, F., Quandt, E.
Source: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 45(10):4770-4772 Oct, 2009
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14Academic Journal
Authors: Reermann, J., Zabel, S., Kirchhof, C., Quandt, E., Faupel, F., Schmidt, G.
Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 16(12):4891-4900 Jun, 2016
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15Periodical
Authors: Schröder, S., Ababii, N., Lupan, O., Drewes, J., Magariu, N., Krüger, H., Strunskus, T., Adelung, R., Hansen, S., Faupel, F.
Source: Materials today chemistry. 23
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16Academic Journal
Authors: Dhawan, A., Zaporojtchenko, V., Faupel, F.
Source: Journal of Materials Science; November 2007, Vol. 42 Issue 21, p9037-9044, 8p
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17Academic Journal
Authors: Faupel, F., Gupta, D., Agarwala, B. N.
Source: Journal of Applied Physics; June 1 1990, Vol. 67, p6807-6812, 6p
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18Academic Journal
Authors: Faupel, F., Yang, C. H., Chen, S. T.
Source: Journal of Applied Physics; March 1 1989, Vol. 65, p1911-1917, 7p
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19Academic Journal
Authors: Chen, S. T., Yang, C. H., Faupel, F.
Source: Journal of Applied Physics; December 15 1988, Vol. 64, p6690-6698, 9p
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20Academic Journal
Authors: Schneider, V., Strunskus, T., Elbahri, M., Faupel, F.
Source: In Carbon August 2015 90:94-101