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1Academic Journal
Authors: Shimizu, A., Fukada, K., Abe, M., Matsui, A., Endo, S.
Source: IEEE Access Access, IEEE. 13:34227-34237 2025
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2Conference
Authors: Rajendran, S., Yogarathnam, A., Zhao, T., Endo, S., Aravinthan, V., Tamimi, A., Yokley, C.R., Yue, M.
Source: 2024 56th North American Power Symposium (NAPS) North American Power Symposium (NAPS), 2024 56th. :1-6 Oct, 2024
Relation: 2024 56th North American Power Symposium (NAPS)
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3Report
Authors: Endo, S., Abe, R., Fujioka, H., Ino, T., Iwamoto, O., Iwamoto, N., Kawamura, S., Kimura, A., Kitaguchi, M., Kobayashi, R., Nakamura, S., Okudaira, T. Oku T., Okuizumi, M., Omer, M., Rovira, G., Shima, T., Shimizu, H. M., Shizuma, T., Taira, Y., Takada, S., Takahashi, S., Yoshikawa, H., Yoshioka, T., Zen, H.
Subject Terms: Physics - Instrumentation and Detectors, Nuclear Experiment
Access URL: http://arxiv.org/abs/2406.15401
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4Conference
Authors: Shimizu, A., Fukada, K., Endo, S.
Source: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :125-126 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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5Conference
Authors: Endo, S., Shimizu, A., Fukada, K.
Source: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :123-124 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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6Report
Authors: Okuizumi, M., Auton, C. J., Endo, S., Fujioka, H., Hirota, K., Ino, T., Ishizaki, K., Kimura, A., Kitaguchi, M., Koga, J., Makise, S., Niinomi, Y., Oku, T., Okudaira, T., Sakai, K., Shima, T., Shimizu, H. M., Tada, H., Takada, S., Takahashi, S., Tani, Y., Yamamoto, T., Yoshikawa, H., Yoshioka, T.
Subject Terms: Nuclear Experiment
Access URL: http://arxiv.org/abs/2402.18876
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7Report
Authors: Nakabe, R., Auton, C. J., Endo, S., Fujioka, H., Gudkov, V., Hirota, K., Ide, I., Ino, T., Ishikado, M., Kambara, W., Kawamura, S., Kimura, A., Kitaguchi, M., Kobayashi, R., Okamura, T., Oku, T., Okudaira, T., Okuizumi, M., Munoz, J. G. Otero, Parker, J. D., Sakai, K., Shima, T., Shimizu, H. M., Shinohara, T., Snow, W. M., Takada, S., Takahashi, R., Takahashi, S., Tsuchikawa, Y., Yoshioka, T.
Subject Terms: Nuclear Experiment, High Energy Physics - Experiment
Access URL: http://arxiv.org/abs/2312.06115
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8Academic Journal
Authors: Cazenave, L., Einenkel, M., Yurkewich, A., Endo, S., Hirche, S., Burdet, E.
Source: IEEE Transactions on Neural Systems and Rehabilitation Engineering IEEE Trans. Neural Syst. Rehabil. Eng. Neural Systems and Rehabilitation Engineering, IEEE Transactions on. 31:4063-4072 2023
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9Academic Journal
Authors: Muslim, H., Endo, S., Imanaga, H., Kitajima, S., Uchida, N., Kitahara, E., Ozawa, K., Sato, H., Nakamura, H.
Source: IEEE Access Access, IEEE. 11:45349-45363 2023
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10Report
Authors: Okudaira, T., Nakabe, R., Endo, S., Fujioka, H., Gudkov, V., Ide, I., Ino, T., Ishikado, M., Kambara, W., Kawamura, S., Kobayashi, R., Kitaguchi, M., Okamura, T., Oku, T., Munoz, J. G. Otero, Parker, J. D., Sakai, K., Shima, T., Shimizu, H. M., Shinohara, T., Snow, W. M., Takada, S., Tsuchikawa, Y., Takahashi, R., Takahashi, S., Yoshikawa, H., Yoshioka, T.
Subject Terms: Nuclear Experiment
Access URL: http://arxiv.org/abs/2309.08905
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11Conference
Authors: Fujisaki, Y., Tsugawa, H., Sakai, K., Kumagai, H., Nakamura, R., Ogita, T., Endo, S., Iwase, T., Takase, H., Yokochi, K., Yoshida, S., Shimada, S., Otake, Y., Wakano, T., Hiyama, H., Hagiwara, K., Arakawal, M., Matsumotol, S., Maeda, H., Sugihara, K., Takabayashi, K., Ono, M., Ishibashi, K., Yamamoto, K.
Source: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
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12Conference
Authors: Endo, S., Shimizu, A., Ueyama, H., Fukada, K., Kashiwagi, Y.
Source: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :111-112 Apr, 2023
Relation: 2023 International Conference on Electronics Packaging (ICEP)
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13Report
Authors: Okudaira, T., Tani, Y., Endo, S., Doskow, J., Fujioka, H., Hirota, K., Kameda, K., Kimura, A., Kitaguchi, M., Luxnat, M., Sakai, K., Schaper, D., Shima, T., Shimizu, H. M., Snow, W. M., Takada, S., Yamamoto, T., Yoshikawa, H., Yoshioka, T.
Subject Terms: Nuclear Experiment
Access URL: http://arxiv.org/abs/2212.10889
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14Report
Authors: Endo, S., Okudaira, T., Abe, R., Fujioka, H., Hirota, K., Kimura, A., Kitaguchi, M., Oku, T., Sakai, K., Shima, T., Shimizu, H. M., Takada, S., Takahashi, S., Yamamoto, T., Yoshikawa, H., Yoshioka, T.
Subject Terms: Nuclear Experiment
Access URL: http://arxiv.org/abs/2210.15807
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15Academic Journal
Authors: Endo, S., Yokogawa, S.
Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(2):1424-1434 Jan, 2022
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16Conference
Authors: Endo, S., Shimizu, A., Ueyama, H., Fukada, K., Kashiwagi, Y., Takamatsu, H., Hashimoto, K., Takahashi, R.
Source: ECS transactions. 111(2):27-34
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17Report
Authors: Koga, J., Takada, S., Endo, S., Fujioka, H., Hirota, K., Ishizaki, K., Kimura, A., Kitaguchi, M., Niinomi, Y., Okudaira, T., Sakai, K., Shima, T., Shimizu, H. M., Tani, Y., Yamamoto, T., Yoshikawa, H., Yoshioka, T.
Subject Terms: Nuclear Experiment
Access URL: http://arxiv.org/abs/2202.06222
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18Conference
Authors: Shimada, S., Otake, Y., Yoshida, S., Jibiki, Y., Fujii, M., Endo, S., Nakamura, R., Tsugawa, H., Fujisaki, Y., Yokochi, K., Iwase, J., Takabayashi, K., Maeda, H., Sugihara, K., Yamamoto, K., Ono, M., Ishibashi, K., Matsumoto, S., Hiyama, H., Wakano, T.
Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :37.3.1-37.3.4 Dec, 2022
Relation: 2022 IEEE International Electron Devices Meeting (IEDM)
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19Conference
Authors: Fukushima, T., Yonekura, H., Doi, F., Endo, S., Fushimi, T., Yanagimura, K., Koyanagi, M., Tanaka, T., Motoyoshi, M.
Source: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :210-213 Oct, 2018
Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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20Report
Authors: Okudaira, T., Endo, S., Fujioka, H., Hirota, K., Ishizaki, K., Kimura, A., Kitaguchi, M., Koga, J., Niinomi, Y., Sakai, K., Shima, T., Shimizu, H. M., Takada, S., Tani, Y., Yamamoto, T., Yoshikawa, H., Yoshioka, T.
Source: Phys. Rev. C 104, 014601 (2021)
Subject Terms: Nuclear Experiment
Access URL: http://arxiv.org/abs/2101.00262