Microhardness Analysis of Reflowed Solder Joints: Effect of Paste Alloy and Paste Volume

Authors: Alakayleh, Abdallah, Tahat, Sufyan, El Amine Belhadi, Mohamed, Bolanos, Sergio, Daradkeh, Saddam, Tarman, Waad, Qasaimeh, Qais, Alahmer, Ali, Hamasha, Sa'd

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-8 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Evaluating Shear Properties of Individual Solder Joints in Ball Grid Arrays: The Impact of Silver (Ag) and Bismuth (Bi) Content

Authors: Tarman, Wa'ad, Alahmer, Ali, Bolanos, Sergio, Pouya, Shaheen, Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Hamasha, Sa'd

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-8 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The Effect of Bi Content and Strain Rate on Tensile Properties of SnAgCu-Bi Alloys

Authors: Bolanos, Sergio, Alahmer, Ali, Alakayleh, Abdallah, Pouya, Shaheen, Vyas, Palash Pranav, El Amine Belhadi, Mohamed, Hamasha, Sa'd

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-6 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Aging Effect on Drop-Shock Reliability of SnAgCu305 Solder Alloy

Authors: Daradkeh, Saddam, Vyas, Palash Pranav, Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Tahat, Sufyan, Alahmer, Ali, Hamasha, Sa'd

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-8 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Shear Strength Analysis of Aging SAC-Bi Solder Joints with Different Solder Paste Volumes

Authors: Pouya, Shaheen, Alahmer, Ali, Bolanos, Sergio, Tahat, Sufyan, Alalkayleh, Abdallah, El Amine Belhadi, Mohamed, Hamasha, Sa'd

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-7 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Drop Shock Test of PCB at Elevated Temperature

Authors: Vyas, Palash Pranav, Alahmer, Ali, Bolanos, Sergio, Pouya, Shaheen, Daradkeh, Saddam, El Amine Belhadi, Mohamed, Hamasha, Sa'd

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-6 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Effect of Solder Paste Alloy and Volume on Solder Voiding

Authors: Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Tahat, Sufyan, HMasha, Ehab, Shmatok, Andrii, Alahmer, Ali, Hamasha, Sa'd

Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-8 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Fatigue and Shear Properties of Novel Lead-free Solder Joints with Low Melting Temperatures

Authors: Wei, Xin, El Amine Belhadi, Mohamed, Vyas, Palash Pranav, Sakib, A R Nazmus, Hamasha, Sa'd, Ali, Haneen

Source: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-7 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint

Authors: El Amine Belhadi, Mohamed, Akkara, Francy John, Hoque, Mohd Aminul, Vyas, Palash Pranav, Wei, Xin, Shmatok, Andrii, Hamasha, Sa'd, Prorok, Barton Charles, Suhling, Jeff, Lall, Pradeep

Source: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :904-910 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling

Authors: Jian, Minghong, Vyas, Palash Pranav, Wei, Xin, El Amine Belhadi, Mohamed, Hamasha, Sa'd, Suhling, Jeff, Lall, Pradeep

Source: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :991-998 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

The Effect of Bi on the Mechanical Properties of Aged SAC Solder Joint

Authors: El Amine Belhadi, Mohamed, John Akkara, Francy, Athamenh, Raed, Abueed, Mohammed, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, Lall, Pradeep

Source: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :1100-1105 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Effects of Multiple Reflows on IMC and Shear Strength of Individual Solder Joints
22nd Thermal and thermomechanical phenomena in electronic systems Conference, ITHERM

Authors: Tahat, Sufyan, Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Alahmer, Ali, Yaeger, Alyssa, Hamasha, Sa'd

Source: ITHERM. 22(2):1095-1103

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN608429291&indx=1&recIds=ETOCCN608429291

Reliability of Different Solder Joint Alloys in Thermal Cycling and Drop Shock Tests
Surface Mount Technology Association (SMTA) International 2022 conference

Authors: Hamasha, Sa'd, El Amine Belhadi, Mohamed, Vyas, Palash, Evans, John

Source: SMTA international conference. 2022:105-114

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN608238254&indx=1&recIds=ETOCCN608238254

Indentation Creep Properties Evolution of Lead-free Solder Joints Subjected to Thermal Cycling
21st Conferecne on Thermal and Thermomechanical phenomena in Electronic Systems

Authors: El Amine Belhadi, Mohamed, Wei, Xin, Qasaimeh, Qais, Vyas, Palash Pranav, Zhao, Rong, Hamasha, Ehab, Ali, Duha, Suhling, Jeff, Hamasha, Sa'd, Lall, Pradeep

Source: ITHERM. 21(2):1036-1043

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607877012&indx=1&recIds=ETOCCN607877012

Drop Shock Performance of SAC-Bi Alloys Compared to SnPb
21st Conferecne on Thermal and Thermomechanical phenomena in Electronic Systems

Authors: Vyas, Palash, El Amine Belhadi, Mohamed, Wei, Xin, Hamasha, Ehab, Alakayleh, Abdallah, Srinivasan, Arvind, Akula, Raj Kiran, Hamasha, Sad, Suhling, Jeff, Lall, Pradeep

Source: ITHERM. 21(2):976-982

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607876951&indx=1&recIds=ETOCCN607876951

Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint (p311)
Thermal and thermomechanical phenomena in electronic systems (Conference)

Authors: El Amine Belhadi, Mohamed, Akkara, Francy John, Hoque, Mohd Aminul, Vyas, Palash Pranav, Wei, Xin, Shmatok, Andrii, Hamasha, Sa'd, Prorok, Barton Charles, Suhling, Jeff, Lall, Pradeep

Source: ITHERM. 19(2):904-910

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607084992&indx=1&recIds=ETOCCN607084992

Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling (p304)
Thermal and thermomechanical phenomena in electronic systems (Conference)

Authors: Jian, Minghong, Vyas, Palash Pranav, Wei, Xin, El Amine Belhadi, Mohamed, Hamasha, Sa'd, Suhling, Jeff, Lall, Pradeep

Source: ITHERM. 19(2):991-998

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607085119&indx=1&recIds=ETOCCN607085119

HE 356: Effect of Temperature on the Fatigue Performance of Solder Joints in Ball Grid Array Assembly
Surface Mount Technology Association, SMTA (International conference)

Authors: Wei, Xin, El Amine Belhadi, Mohamed, Vyas, Palash Pranav, Hamasha, Sa'D, Suhling, Jeff, Lall, Pradeep

Source: SMTA international conference. 1:264-274

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607443759&indx=1&recIds=ETOCCN607443759

Employing spatial and amplitude discriminators to partition and analyze LPBF surface features

Authors: Zhao, Rong, Shmatok, Andrii, Fischer, Ralf, Deng, Pu, El Amine Belhadi, Mohamed, Hamasha, Sa'd, Prorok, Barton C.

Source: In Precision Engineering November 2022 78:90-101