ISQ: Intermediate-Value Slip Quantization for Accumulator-Aware Training

Authors: Zhang, C., Yang, X., Yu, S., Dou, R., Liu, L.

Source: IEEE Signal Processing Letters IEEE Signal Process. Lett. Signal Processing Letters, IEEE. 32:976-980 2025

PointNet++SAKS: A Point Cloud Model Based on KANs and Attention Mechanism for Objects Classification and Semantic Segmentation

Authors: Lu, X., Guan, Z., Pang, D., Dou, R., Zheng, X.

Source: IEEE Access Access, IEEE. 13:29292-29304 2025

Nanocrystalline Power Loss and Thermal Mitigation for 11.1 kW Inductive Power Transfer Pads: A Novel Frequency-Dependent Optimization

Authors: Dou, R., Li, Y., Zhang, X., Yang, Q., Zhang, P., Zhao, L., Cheng, Z., Li, A., Hu, A.P.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 40(1):2513-2526 Jan, 2025

SDC2 and TFPI2 Methylation in Stool Samples as an Integrated Biomarker for Early Detection of Colorectal Cancer

Authors: Zhang W, Yang C, Wang S, Xiang Z, Dou R, Lin Z, Zheng J, Xiong B

Source: Cancer Management and Research, Vol Volume 13, Pp 3601-3617 (2021)

Subject Terms: dna methylation, colorectal cancer, early detection, sdc2, tfpi2, stool, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282

File Description: electronic resource

Relation: https://www.dovepress.com/sdc2-and-tfpi2-methylation-in-stool-samples-as-an-integrated-biomarker-peer-reviewed-fulltext-article-CMAR; https://doaj.org/toc/1179-1322

Access URL: https://doaj.org/article/3c4cb33bd50249ef91e873060aa0dce3

SDC2 and TFPI2 Methylation in Stool Samples as an Integrated Biomarker for Early Detection of Colorectal Cancer [Corrigendum]

Authors: Zhang W, Yang C, Wang S, Xiang Z, Dou R, Lin Z, Zheng J, Xiong B

Source: Cancer Management and Research, Vol Volume 14, Pp 1845-1846 (2022)

Subject Terms: dna methylation, colorectal cancer, early detection, sdc2, tfpi2, stool, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282

File Description: electronic resource

Relation: https://www.dovepress.com/corrigendum-sdc2-and-tfpi2-methylation-in-stool-samples-as-an-integrat-peer-reviewed-fulltext-article-CMAR; https://doaj.org/toc/1179-1322

Access URL: https://doaj.org/article/b1e612c984574f45ba7e202532d2efdf

Survival advantage and clinicopathological significance of microRNA-22 in cancers: a meta-analysis

Authors: Xiang Q, Xiang Z, Dou R, Xiong B

Source: Cancer Management and Research, Vol Volume 11, Pp 8855-8868 (2019)

Subject Terms: hsa-miR-22, cancer, prognosis, clinicopathological, biomarker, meta-analysis, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282

File Description: electronic resource

Relation: https://www.dovepress.com/survival-advantage-and-clinicopathological-significance-of-microrna-22-peer-reviewed-article-CMAR; https://doaj.org/toc/1179-1322

Access URL: https://doaj.org/article/230fd663b6c04175b91a7da68d42c56b

A Bio-Inspired Spiking Vision Chip Based on SPAD Imaging and Direct Spike Computing for Versatile Edge Vision

Authors: Yang, X., Yao, C., Kang, L., Luo, Q., Qi, N., Dou, R., Yu, S., Feng, P., Wei, Z., Liu, J., Wang, K., Wu, N., Liu, L.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 59(6):1883-1898 Jun, 2024

Edge Computation Offloading With Content Caching in 6G-Enabled IoV

Authors: Zhou, X., Bilal, M., Dou, R., Rodrigues, J.J.P.C., Zhao, Q., Dai, J., Xu, X.

Source: IEEE Transactions on Intelligent Transportation Systems IEEE Trans. Intell. Transport. Syst. Intelligent Transportation Systems, IEEE Transactions on. 25(3):2733-2747 Mar, 2024

A Real-Time 2D/3D Perception Visual Vector Processor for 1920 × 1080 High-Resolution High-Speed Intelligent Vision Chips

Authors: Wei, S., Ning, K., Kang, L., Zheng, X., Zhao, M., Xu, M., Wang, S., Xu, X., Dou, R., Yu, S., Yang, X., Liu, J., Shi, C., Wu, N., Liu, L.

Source: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 71(2):740-753 Feb, 2024

Research on Fine-Grained Image Classification with Residual Network and Feature Fusion

Authors: Xin, H., Dou, R.

Source: 2023 3rd International Conference on Electronic Information Engineering and Computer Science (EIECS) Electronic Information Engineering and Computer Science (EIECS), 2023 3rd International Conference on. :43-47 Sep, 2023

Relation: 2023 3rd International Conference on Electronic Information Engineering and Computer Science (EIECS)

A 24.3 μJ/Image SNN Accelerator for DVS-Gesture With WS-LOS Dataflow and Sparse Methods

Authors: Kang, L., Yang, X., Zhang, C., Yu, S., Dou, R., Li, W., Shi, C., Liu, J., Wu, N., Liu, L.

Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 70(11):4226-4230 Nov, 2023

Ferrite Pads Gap Thermal-Magnetic Evaluation and Mitigation for 11.1 kW Wireless Power Transfer

Authors: Zhang, X., Hao, C., Dou, R., Liu, S., Zhao, L., Zhang, P., Yang, Q.

Source: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 59(11):1-6 Nov, 2023

A Novel Hybrid Shielding Method With Single-Source Active Topology and Efficiency Stability for Wireless Power Transfer

Authors: Zhang, X., Liu, S., Dou, R., Hao, C., Zhao, L., Zhang, P., Yang, Q.

Source: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 59(11):1-6 Nov, 2023

Magnetic Coupling Mechanism With Omnidirectional Magnetic Shielding for Wireless Power Transfer

Authors: Dai, Z., Zhang, X., Liu, T., Pei, C., Chen, T., Dou, R., Wang, J.

Source: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 65(5):1565-1574 Oct, 2023

Hierarchical Parallel Vision Processor for High-Speed Ship Detection

Authors: Xu, M., Zhang, Z., Li, H., Luo, Q., Dou, R., Liu, L., Liu, J., Wu, N.

Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 70(3):1164-1168 Mar, 2023

Masked Swin Transformer Unet for Industrial Anomaly Detection

Authors: Jiang, J., Zhu, J., Bilal, M., Cui, Y., Kumar, N., Dou, R., Su, F., Xu, X.

Source: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 19(2):2200-2209 Feb, 2023

Improved Estimation of Leaf Area Index by Reducing Leaf Chlorophyll Content and Saturation Effects Based on Red-Edge Bands

Authors: Zhang, Z., Jin, W., Dou, R., Cai, Z., Wei, H., Wu, T., Yang, S., Tan, M., Li, Z., Wang, C., Yin, G., Xu, B.

Source: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 61:1-14 2023

A Provisional Labels-Reduced, Real-Time Connected Component Labeling Algorithm for Edge Hardware

Authors: Zhou, H., Dou, R., Cheng, L., Liu, J., Wu, N.

Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 69(6):2997-3001 Jun, 2022

ViP: A Hierarchical Parallel Vision Processor for Hybrid Vision Chip

Authors: Zheng, X., Cheng, L., Zhao, M., Luo, Q., Li, H., Dou, R., Yu, S., Wu, N., Liu, L.

Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 69(6):2957-2961 Jun, 2022

A Fast-Automated Scheduling Method Based on Genetic Algorithm for Final Assembly Workshop

Authors: Zeng, X., Luo, L., Huang, B., Dou, R., Zhuang, J., Zheng, T., Chen, Y., Da, Y.

Source: 2020 IEEE 6th International Conference on Control Science and Systems Engineering (ICCSSE) Control Science and Systems Engineering (ICCSSE),2020 IEEE 6th International Conference on. :243-247 Jul, 2020

Relation: 2020 IEEE 6th International Conference on Control Science and Systems Engineering (ICCSSE)