Showing 1 - 7 results of 7 Refine Results
  1. 1
    Conference

    Effects of Ce3+ on removal rate of ceria slurries in chemical mechanical polishing for SiO2

    Authors: Doi, Haruhiko, Suzuki, Masahiko, Kinuta, Kouji

    Source: Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :194-198 Nov, 2014

    Relation: 2014 International Conference on Planarization/CMP Technology (ICPT)

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  2. 2
    Patent

    Polishing liquid composition for magnetic-disk substrate

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  3. 3
    Patent

    Method for manufacturing an aluminosilicate glass substrate for hard disks

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  4. 4
    Patent

    Polishing composition for magnetic disk substrate

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  5. 5
    Patent

    POLISHING LIQUID COMPOSITION FOR MAGNETIC-DISK SUBSTRATE

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  6. 6
    Patent

    POLISHING LIQUID COMPOSITION FOR MAGNETIC DISK SUBSTRATE

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  7. 7
    Patent

    Polishing composition for magnetic disk substrate

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