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  1. 1
    Conference

    Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-9 May, 2024

    Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

  2. 2
    Conference

    Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :654-655 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

  3. 3
    Conference

    Source: 2022 6th International Conference on System Reliability and Safety (ICSRS) System Reliability and Safety (ICSRS), 2022 6th International Conference on. :483-488 Nov, 2022

    Relation: 2022 6th International Conference on System Reliability and Safety (ICSRS)

  4. 4
    Academic Journal
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  7. 7
    Academic Journal

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    Periodical

    Source: Nanoscale. 12(27):14626-14635

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  11. 11
    Academic Journal

    Authors: Behzad, Mehdi1, feizhoseini.sajjad@mech.sharif.irm_behzad@sharif.edu, Feizhoseini, Sajjad1, alidavoodabadi@mech.sharif.ir, Arghand, Hesam Addin2, h.a.arghand@gmail.com, Davoodabadi, Ali1, Mba, David3, david.mba@dmu.ac.uk

    Source: Applied Sciences (2076-3417); Jan2021, Vol. 11 Issue 1, p160, 18p

    PDF Full Text
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    Academic Journal
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    Academic Journal
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