High bandwidth interconnect design opportunities in 2.5D Through-Silicon interposer (TSI)

Authors: Weerasekera, Roshan, Chang, Ka Fai, Zhang, Songbai, Katti, Guruprasad, Li, Hong Yu, Dutta, Rahul, Cubillo, Joseph Romen

Source: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :241-244 Nov, 2016

Relation: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

Analysis of signal and power/ground pin assignment in multi-layer PCB and its impact on signal integrity and crosstalk

Authors: Chang, Ka Fai, Cubillo, Joseph Romen, Weerasekera, Roshan, Jin, Cheng, Zheng, Boyu, Bhattacharya, Suryanarayana Shivakumar

Source: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :789-792 Dec, 2013

Relation: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

Through-Silicon Interposer (TSI) co-design optimization for high performance systems

Authors: Cubillo, Joseph Romen, Weerasekera, Roshan, Katti, Guruprasad, Patti, Robert

Source: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :93-98 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

Study on low-cost QFN packages for high-frequency applications

Authors: Zheng, Boyu, Cubillo, Joseph Romen, Katti, Guruprasad, Jin, Cheng, Rajoo, Ranjan, Chan, Kai Chong

Source: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :401-406 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

Effective resistance approach for DC analysis of power grid on through-silicon interposer (TSI)

Authors: Liu, En-Xiao, Cubillo, Joseph Romen, Li, Er-Ping, Zhao, Huapeng, Oo, Zaw Zaw, Lee, Hui Min

Source: 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE. :1-4 Dec, 2012

Relation: 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

Systematic analysis for static and dynamic drops in power supply grids of 3-D integrated circuits

Authors: Oo, Zaw Zaw, Liu, En-Xiao, Cubillo, Joseph Romen, Li, Er-Ping

Source: 2012 Asia-Pacific Symposium on Electromagnetic Compatibility Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on. :49-52 May, 2012

Relation: 2012 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

Interconnect design and analysis for Through Silicon Interposers (TSIs)

Authors: Cubillo, Joseph Romen, Weerasekera, Roshan, Oo, Zaw Zaw, Liu, En-Xiao, Conn, Bob, Bhattacharya, Surya, Patti, Robert

Source: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-6 Jan, 2012

Relation: 2011 IEEE International 3D Systems Integration Conference (3DIC)

Chip-Package co-design of 10 GHz bandwidth low noise active front-end interface

Authors: Fourquin, Olivier, Battista, Marc, Cubillo, Joseph Romen, Gaubert, Jean, Bourdel, Sylvain

Source: 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :1612-1617 May, 2009

Relation: 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

Enhanced wire bond transition from die to chip carrier for 3.1-10.6 GHz UWB applications

Authors: Fourquin, Olivier, Cubillo, Joseph Romen, Gaubert, Jean, Bourdel, Sylvain, Battista, Marc

Source: 2008 Electrical Design of Advanced Packaging and Systems Symposium Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of. :218-221 Dec, 2008

Relation: 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

Analysis of signal integrity(SI) robustness in through-silicon interposer (TSI) interconnects

Authors: Weerasekera, Roshan, Cubillo, Joseph Romen, Katti, Guruprasad

Source: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :397-398 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

Interconnect design and analysis for Through Silicon Interposers (TSIs).

Authors: Cubillo, Joseph Romen, Weerasekera, Roshan, Oo, Zaw Zaw, Liu, En-Xiao, Conn, Bob, Bhattacharya, Surya, Patti, Robert

Source: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International; 1/ 1/2011, p1-6, 6p

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