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  1. 1
    Academic Journal

    Authors: Chin, Yu-Ting1,2 (AUTHOR), Tsai, Chung-Lin3 (AUTHOR), Ma, Hung-Huan4 (AUTHOR), Cheng, Da-Chuan5 (AUTHOR), Tsai, Chia-Wen1,2,6 (AUTHOR) jiangu@mdanderson.org, Wang, Yun-Chi1,2 (AUTHOR), Shih, Hou-Yu1,2 (AUTHOR), Chang, Shu-Yu1,2,7 (AUTHOR), Gu, Jian6 (AUTHOR), Chang, Wen-Shin1,2,6 (AUTHOR) 031002@tool.caaumed.org.tw, Bau, Da-Tian1,2,6,8 (AUTHOR) 031002@tool.caaumed.org.tw

    Source: Life (2075-1729). Aug2024, Vol. 14 Issue 8, p1035. 14p.

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  2. 2
    Conference

    Source: 2016 International Computer Symposium (ICS) ICS Computer Symposium (ICS), 2016 International. :435-440 Dec, 2016

    Relation: 2016 International Computer Symposium (ICS)

  3. 3
    Conference

    Source: 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on. :1-5 Apr, 2013

    Relation: 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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  5. 5
    Conference

    Source: 2010 International Conference on Electronics and Information Engineering Electronics and Information Engineering (ICEIE), 2010 International Conference On. 2:V2-309-V2-313 Aug, 2010

    Relation: 2010 International Conference on Electronics and Information Engineering (ICEIE 2010)

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    Academic Journal
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    Academic Journal
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    Academic Journal
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    Academic Journal
  16. 16
    Academic Journal

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    Academic Journal

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    Academic Journal

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