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    Academic Journal

    Authors: Cheng, Christopher1 (AUTHOR) ckcheng08@gmail.com, Katoch, Parul2 (AUTHOR), Zhong, Yong-Ping1 (AUTHOR), Higgins, Claire T.1 (AUTHOR), Moredock, Maria1 (AUTHOR), Chang, Matthew E. K.2 (AUTHOR), Flory, Mark R.2 (AUTHOR), Randell, Scott H.3 (AUTHOR), Streeter, Philip R.1 (AUTHOR)

    Source: International Journal of Molecular Sciences. Sep2024, Vol. 25 Issue 18, p9863. 19p.

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    Conference

    Source: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :741-744 Aug, 2017

    Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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    Conference

    Source: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :299-301 Oct, 2018

    Relation: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)