Ultra-low loss on-chip magnetic inductors in the far-BEOL for high frequency power electronics

Authors: Ali, Zishan, Peng, Lulu, Rohlfs, Patrick, Ng, Yong Chau, Lehmann, Lothar, Cheng, Chor Shu, Selvaraj, Lawrence, Wieland, Marcel

Source: 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2021 33rd International Symposium on. :395-398 May, 2021

Relation: 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Silicon-based Ultimate Miniature Magnetic Inductors Technology for High-efficiency DC-DC Conversion

Authors: Peng, Lulu, Ali, Zishan, Selvaraj, Lawrence, Cheng, Chor Shu, Ng, Yong Chau, Yosokumoro, Nur Aziz, Lehmann, Lothar, Rohlfs, Patrick, Wieland, Marcel

Source: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2020 32nd International Symposium on. :384-387 Sep, 2020

Relation: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)

On-Chip Thin Film Inductor for High Frequency DC-DC Power Conversion Applications

Authors: Selvaraj, S. Lawrence, Haug, Martin, Cheng, Chor Shu, Dinulovic, Dragan, Peng, Lulu, Shafey, Khaled El, Ali, Zishan, Shousha, Mahmoud, Ng, Yong Chau, Aziz Yosokumoro, Nur, Lehmann, Lothar, Wieland, Marcel

Source: 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2020 IEEE. :176-180 Mar, 2020

Relation: 2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

4-Point-Bending Characterization of Interfacial Adhesion Strength of Co-Zr-Ta and Co-Zr-Ta Variant Thin-Film Stacks

Authors: Zhu, Xintong, Li, Xiaoxuan, Nistala, Ramesh Rao, Ali, Zishan, Peng, Lulu, Selvaraj, Lawrence, Cheng, Chor Shu, Mo, Zhi Qiang

Source: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2019 IEEE 26th International Symposium on. :1-4 Jul, 2019

Relation: 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Novel on-chip high-Q power inductor for high-efficient PowerSoC Applications

Authors: Peng, Lulu, Raju, Salahuddin, Disney, Don, Selvaraj, Lawrence, Mohammed, Zishan Ali Syed, Soh, Serine, Jien, Chui King, Singh, Ravinder Pal, Cheng, Chor Shu

Source: 2019 Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2019. :392-394 Mar, 2019

Relation: 2019 Electron Devices Technology and Manufacturing Conference (EDTM)

55nm Ultra-low Power (55ULP) Automotive Grade HD SRAM with Sub 0.7V 16Mb Vmin

Authors: Phung, Thanh Hoa, Balan, Hari, Balasubramanian, Sriram, Wu, Zeng-Yuan, Khoo, Patrick, Cheng, Chor Shu, Chan, Tze Ho

Source: 2019 Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2019. :4-6 Mar, 2019

Relation: 2019 Electron Devices Technology and Manufacturing Conference (EDTM)

Study for phosphorus contamination to high voltage transistors

Authors: Li Liang, Luo Qiong, Wu Zeng Yuan, Tan Yun Ling, Alex, See, Chua Soo Cheng, Troy Zhu, Cheng Chor Shu

Source: 2016 International Symposium on Semiconductor Manufacturing (ISSM) Semiconductor Manufacturing (ISSM), 2016 International Symposium on. :1-4 Dec, 2016

Relation: 2016 International Symposium on Semiconductor Manufacturing (ISSM)

Integrated circuit structure with electrical strap and its method of forming

INTEGRATED CIRCUIT STRUCTURE WITH ELECTRICAL STRAP

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