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  1. 1
    Conference

    Source: 2024 4th International Conference on Electronic Information Engineering and Computer Science (EIECS) Electronic Information Engineering and Computer Science (EIECS), 2024 4th International Conference on. :774-779 Sep, 2024

    Relation: 2024 4th International Conference on Electronic Information Engineering and Computer Science (EIECS)

  2. 2
    Conference

    Source: 2022 International Conference on Cyber-Physical Social Intelligence (ICCSI) Cyber-Physical Social Intelligence (ICCSI), 2022 International Conference on. :211-215 Nov, 2022

    Relation: 2022 International Conference on Cyber-Physical Social Intelligence (ICCSI)

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    Conference

    Source: 2020 IEEE 4th Information Technology, Networking, Electronic and Automation Control Conference (ITNEC) Automation Control Conference (ITNEC), 2020 IEEE 4th Information Technology, Networking, Electronic and. 1:1412-1416 Jun, 2020

    Relation: 2020 IEEE 4th Information Technology, Networking, Electronic and Automation Control Conference (ITNEC)

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    Academic Journal

    Source: In Chaos, Solitons and Fractals: the interdisciplinary journal of Nonlinear Science, and Nonequilibrium and Complex Phenomena December 2024 189 Part 1

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    Conference

    Source: 2019 15th International Conference on Mobile Ad-Hoc and Sensor Networks (MSN) Mobile Ad-Hoc and Sensor Networks (MSN), 2019 15th International Conference on. :343-347 Dec, 2019

    Relation: 2019 15th International Conference on Mobile Ad-Hoc and Sensor Networks (MSN)

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    Academic Journal

    Authors: Chen, Yuyun1, yyunchen@goworld-lcd.com, Shen, Yi1, yishen@goworld-lcd.comymchen@goworld-lcd.com, Chen, Yuanming1, guodxu@goworld-lcd.com, Xu, Guodong1, ydliu@goworld-lcd.com, Liu, Yudong1, Huang, Rui2, yishen@goworld-lcd.com

    Source: Coatings (2079-6412); May2024, Vol. 14 Issue 5, p555, 14p

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  16. 16
    Conference

    Source: 2016 9th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI) Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), International Congress on. :1188-1193 Oct, 2016

    Relation: 2016 9th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI)

  17. 17
    Conference

    Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :231-233 Oct, 2017

    Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

  18. 18
    Conference

    Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :111-113 Oct, 2017

    Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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