Critical Structural Parameter Determining Magnetic Phases in the Fe2Mo3O8 Altermagnet System

Authors: Tyson, T. A., Liu, S., Amarasinghe, S., Wang, K., Chariton, S., Prakapenka, V., Chang, T., Chen, Y. -S., Pollock, C. J., Cheong, S. -W., Abeykoon, M.

Subject Terms: Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/2503.09880

Hydrogen Trapping and Embrittlement in Metals -- A Review

Authors: Chen, Y. -S., Huang, C., Liu, P. -Y., Yen, H. -W., Niu, R., Burr, P., Moore, K. L., Martínez-Pañeda, E., Atrens, A., Cairney, J. M.

Subject Terms: Physics - Chemical Physics, Condensed Matter - Materials Science, Physics - Applied Physics

Access URL: http://arxiv.org/abs/2404.07736

Measurement of the $^{159}$Tb(n, $\gamma$) cross section at the CSNS Back-n facility

Authors: Zhang, S., Li, G., Jiang, W., Wang, D. X., Ren, J., Li, E. T., Huang, M., Tang, J. Y., Ruan, X. C., Wang, H. W., Li, Z. H., Chen, Y. S., Liu, L. X., Li, X. X., Fan, Q. W., Fan, R. R., Hu, X. R., Wang, J. C., Li, X., Niu, 1D. D., Song, N., Gu, M.

Subject Terms: Nuclear Experiment, Astrophysics - Solar and Stellar Astrophysics

Access URL: http://arxiv.org/abs/2212.01820

A Micromachined Multimodal Probe Technology for Ischemia Muscle Monitoring

Authors: Cheng, Y. T., Chen, Y. S.

Source: 2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) Solid-State & Integrated Circuit Technology (ICSICT, 2020 IEEE 15th International Conference on. :1-5 Nov, 2020

Relation: 2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

Determination of the Inner Surface Area of 3D Wavelength Scale Structures by Using Angle-resolved Fourier Image Spectroscopy

Authors: Palakkool, N. M., Taverne, M. P. C., Rezaie, D., Awachi, H., Chen, Y.-S. J., Rarity, J.G., Huang, C.-C., Ho, Y.-L. D.

Source: 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), 2023 Conference on. :1-1 Jun, 2023

Relation: 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

Terahertz-infrared dielectric properties of lead-aluminum double-cation substituted single-crystalline barium hexaferrite

Authors: Ahmed, Asmaa, Prokhorov, Anatoly S., Anzin, Vladimir, Vinnik, Denis, Ivanov, Sergei, Stash, Adam, Chen, Y. S., Bush, Alexander, Gorshunov, Boris, Alyabyeva, Liudmila

Subject Terms: Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/2108.08571

MLC PCM Techniques to Improve Nerual Network Inference Retention Time by 105X and Reduce Accuracy Degradation by 10.8X

Authors: Khwa, W. S., Akarvardar, K., Chen, Y. S., Chiu, Y. C., Liu, J. C., Wu, J. J., Lee, H. Y., Yu, S. M., Lee, C. H., Chen, T. C., Lin, Y. C., Hsu, C. F., Lee, T. Y., Ku, T. K., Kuo, C. H., Wu, J. Y., Bao, X. Y., Chang, C. S., Chih, Y. D., Wong, H.-S. P., Chang, M. F.

Source: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

Low-voltage (~1.3V), Arsenic Free Threshold Type Selector with Ultra High Endurance (> 1011) for High Density 1S1R Memory Array

Authors: Wu, C. H., Lee, C. M., Chen, Y. S., Lee, H. Y., Ambrosi, E., Hsu, C. F., Vaziri, S., Chen, Y. Y., Nien, C. H., Hwang, R. L., Liao, P. J., Hou, D. H., Lee, Y.-H., Lee, T. Y., Chen, T. C., Chang, M. F., Wong, H.-S. P., Bao, X. Y.

Source: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

Membrane chips lithography for microfluidic hydrogel-based microstructures

Authors: Chen, Y.-S., Yeh, T.-Y., Ke, L.-Y., Lan, T.-T., Liu, C.-H.

Source: 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017 19th International Conference on. :2191-2194 Jun, 2017

Relation: 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

High-Resolution In-situ Synchrotron X-ray Studies of Inorganic Perovskite CsPbBr$_3$: New Symmetry Assignments and Structural Phase Transitions

Authors: Liu, S., DeFilippo, A. R., Balasubramanian, M., Liu, Z., Wang, S. G., Chen, Y. -S., Chariton, S., Prakapenka, V., Lou, X., Zhao, L., Martin, J. San, Lin, Y., Yan, Y., Ghose, S., Tyson, T. A.

Subject Terms: Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/2005.04780

Intertwined density waves in a metallic nickelate

Authors: Zhang, J., Phelan, D., Botana, A. S., Chen, Y-S., Zheng, H., Krogstad, M., Wang, S. G., Qiu, Y., Rodriguez-Rivera, J. A., Osborn, R., Rosenkranz, S., Norman, M. R., Mitchell, J. F.

Source: Nat. Commun. 11, 6003 (2020)

Subject Terms: Condensed Matter - Strongly Correlated Electrons, Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/2004.07897

Transformation of Cu(OH)2 to mesostructural copper-silicate in alkaline silicate solution

Authors: Chen, Y.-W., Chen, Y.-S., Lin, S.-F., Chen, Y.-Y., Hung, W.-Y., Lin, H.-P., Tang, C.-Y., Lin, C.-Y., Hsu, C.-H.

Source: In Materials Today Sustainability December 2023 24

Exploring the thermal effect of far-infrared therapy on the kinetics of blood cells by optical tweezers

Authors: Yang, B.-W., Lin, P.-C., Chao, C.-T., Chen, Y.-S.

Source: 2016 International Conference on Applied System Innovation (ICASI) Applied System Innovation (ICASI), 2016 International Conference on. :1-4 May, 2016

Relation: 2016 International Conference on Applied System Innovation (ICASI)

Nature of the Structural Symmetries Associated with Hybrid Improper Ferroelectricity in Ca3X2O7

Authors: Liu, S., Zhang, H., Ghose, S., Balasubramanian, M., Liu, Zhenxian, Wang, S. G., Chen, Y-S., Gao, B., Kim, J., Cheong, S. -W., Tyson, T. A.

Source: Phys. Rev. B 99, 224105 (2019)

Subject Terms: Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/1903.07690

Analyses of printed circuit boards subjected to vibration loadings under various clamping types and reinforced ribs

Authors: Chen, Y. S., Lai, H. K., Lin, T. C., Chang, P. H., Jen, M. U.

Source: 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International. :378-381 Oct, 2015

Relation: 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Identification of rice paddy fields from multitemporal polarimetric SAR images by scattering matrix decomposition

Authors: Fan, K. T., Chen, Y. S., Lin, C. W., Tzeng, Y. C.

Source: 2015 IEEE International Geoscience and Remote Sensing Symposium (IGARSS) Geoscience and Remote Sensing Symposium (IGARSS), 2015 IEEE International. :3199-3202 Jul, 2015

Relation: IGARSS 2015 - 2015 IEEE International Geoscience and Remote Sensing Symposium

DEFORMATION LAW OF AEROSPACE THIN-WALLED THE RODS WITH THREE-ROLL SIZE REDUCTION AND END EXTRUSION THICKENING.

Authors: CHEN, Y. S.¹, SHU, X. D.¹ shuxuedao@nbu.edu.cn, XIA, Y. X.¹, LI, Z. X.¹, XU, H. J.¹, ZHANG, S.¹

Source: Metalurgija. 2024, Vol. 63 Issue 2, p233-236. 4p.

Subject Terms: *PIPE fittings, *FINITE element method, *PLASTIC extrusion, *ALUMINUM alloys, *BUSHINGS, *DENTAL metallurgy

Applying the stimulus-organism-response model to consumer purchasing behavior in social commerce

Authors: Wu, C. H., Wang, W. R., Chen, Y. S., Juan, P. L.

Source: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW) Consumer Electronics - Taiwan (ICCE-TW), 2019 IEEE International Conference on. :1-2 May, 2019

Relation: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW)

Accelerateci life assessment methods for thermoelectric modules with mechanical stress tests

Authors: Chen, Y. S., Hsu, Y. H., Ho, C. H.

Source: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International. :213-216 Oct, 2014

Relation: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

New observations on the regular and irregular noise behavior in a resistance random access memory

Authors: Chen, Scott C. H., Huang, Y. J., Chung, S. S., Lee, H. Y., Chen, Y. S., Chen, F. T., Gu, P. Y., Tsai, M.-J.

Source: 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International. :94-98 Oct, 2014

Relation: 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW)