A D Band Zero Bias Detector Chip Using Schottky Diode

Authors: Ji, D. F., Niu, B., Tao, H. Q., Chen, T. S., Wang, W. B.

Source: 2022 Photonics & Electromagnetics Research Symposium (PIERS) Photonics & Electromagnetics Research Symposium (PIERS), 2022. :752-754 Apr, 2022

Relation: 2022 Photonics & Electromagnetics Research Symposium (PIERS)

Sub-ns Access Sub-mW/GHz 32 Kb SRAM with 0.45 V Cross-Point-5T Cell and Built-in Y_ Line

Authors: He, C.Y., Tang, K. H., Chen, T. S., Chang, K. Y., Lin, C. H., Sato, K., Jou, S. J., Chen, P. H., Chen, H. M., Rong, B. D., Itoh, K.

Source: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC) Asian Solid-State Circuits Conference (A-SSCC), 2019 IEEE. :227-230 Nov, 2019

Relation: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC)

Overview of Efficient Compressive Sensing Reconstruction Engines for E-Health Applications

Authors: Chen, T.-S., Hou, K.-N., Pua, Y.-W., Wu, A.-Y.

Source: 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Solid-State and Integrated Circuit Technology (ICSICT), 2018 14th IEEE International Conference on. :1-4 Oct, 2018

Relation: 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Characterization of new design small water volume arm for CMP dresser

Authors: Chen, C. C., Chen, T. S., Yeh, K., Cheng, M. H., Huang, J. K., Hung, P. W.

Source: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2017 28th Annual SEMI. :384-386 May, 2017

Relation: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Three-tier chips stack with TSVs for backside illuminated image sensor/ADC/ISP

Authors: Chang, H. H., Hsiao, Z. C., Chien, C. H., Zhan, C. J., Hsin, Y. C., Tzeng, P. J., Chen, T. S., Ko, C. T., Lo, W. C., Kao, M. J.

Source: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2014. :1-6 Sep, 2014

Relation: 2014 Electronics System-Integration Technology Conference (ESTC)

Process integration for backside illuminated image sensor stacked with Analog-to-Digital Conversion chip

Authors: Chang, H. H., Chien, C. H., Lee, Y. C., Lee, S. M., Wang, J. C., Huang, Y. W., Zhan, C. J., Hsiao, Z. C., Tzeng, P. J., Lee, C. H., Chen, T. S., Ko, C. T., Lo, W. C., Kao, M. J.

Source: 2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :39-43 Apr, 2014

Relation: 2014 International Conference on Electronics Packaging (ICEP)

Carbon Nanotube Lateral Field Emission Device with Embedded Field Effect Transistor

Authors: Yang, Y., Huo, S., Jiang, L. H., Kong, Y. C., Chen, T. S., Zhou, H., Teh, A. S., Butler, T., Hasko, D., Amaratunga, G. A.

Source: 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC) Electron Devices and Solid State Circuits (EDSSC), 2018 IEEE International Conference on. :1-2 Jun, 2018

Relation: 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC)

100 nm Gate-Length AlGaN/GaN FinFETs with High Linearity of Gm and fT/fmax

Authors: Zhang, K., Zhu, G. R., Kong, Y.C., Chen, T. S.

Source: 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Microwave and Millimeter Wave Technology (ICMMT), 2018 International Conference on. :1-2 May, 2018

Relation: 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

Layer-Aware Program-and-Read Schemes for 3D Stackable Vertical-Gate BE-SONOS NAND Flash Against Cross-Layer Process Variations

Authors: Hung, C.-H., Chang, M.-F., Yang, Y.-S., Kuo, Y.-J., Lai, T.-N., Shen, S.-J., Hsu, J.-Y., Hung, S.-N., Lue, H.-T., Shih, Y.-H., Huang, S.-L., Chen, T.-W., Chen, T. S., Chen, C. K., Hung, C.-Y., Lu, C.-Y.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 50(6):1491-1501 Jun, 2015

Developing the Ka-band GaN power HEMT devices

Authors: Zhou, J. J., Dong, X., Kong, C., Kong, Y. C., Ren, C. J., Li, Z. H., Chen, T. S., Chen, C., Zhang, B.

Source: Proceedings of 2012 5th Global Symposium on Millimeter-Waves Millimeter Waves (GSMM), 2012 5th Global Symposium on. :617-620 May, 2012

Relation: 2012 5th Global Symposium on Millimeter Waves (GSMM 2012)

InAlN/AlN/GaN HEMTs on sapphire substrate

Authors: Liu, H. Q., Zhou, J. J., Dong, X., Chen, T. S., Chen, C.

Source: 2010 International Conference on Microwave and Millimeter Wave Technology Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on. :2059-2062 May, 2010

Relation: 2010 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

A 3D Biological Filtration Matrix Using Self-Assembled Microspheres Inside microchannels and Gelatin Sacrificial Layer

Authors: Chen, T.-S., Chen, C.-P., Tsai, Y.-C., Shih, W.-P., Lin, W.-C.

Source: 19th IEEE International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on. :506-509 2006

Relation: 19th IEEE International Conference on Micro Electro Mechanical Systems

Classification of Microarray Gene Expression Data Using a New Binary Support Vector System

Authors: Chen, T.-S., Chen, R.-C., Lin, C.-C., Tsai, T.-H., Li, S.-Y., Liang, X.

Source: 2005 International Conference on Neural Networks and Brain Neural Networks and Brain Neural Networks and Brain, 2005. ICNN&B '05. International Conference on. 1:485-489 2005

Relation: Proceedings of 2005 International Conference on Neural Networks and Brain

Development of Magnetic Particle-Based Immunoassays and Their Applications in Diabetes Monitoring

Authors: Chen, C.-T., Chen, C.-A., Tsai, Y.-Y., Yuan, Y.-Y., Huang, Y.-C., Chen, T.-S., Tsai, J. S. C.

Source: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 50(1):1-4 Jan, 2014

Implementation of memory stacking on logic controller by using 3DIC 300mm backside TSV process integration

Authors: Chen, S.-C., Tzeng, P.-J., Hsm, Y.-C., Wang, C.-C., Chang, P.-C., Chen, J.-C., Chang, Y.-H., Chen, T.-S., Hsu, T.-C., Chang, H.-H., Zhan, C.-J., Lee, C.-H., Chou, Y.-F., Kwai, D.-M., Ku, T.-K., Wang, P.-H., Lo, W.-C.

Source: 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) VLSI Technology, Systems and Application (VLSI-TSA), 2016 International Symposium on. :1-2 Apr, 2016

Relation: 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

Controllable Petri Net-Based Implementation Approach for Motor Control Systems

Authors: Kuo, C.-H., Chen, T.-S.

Source: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 60(10):4599-4612 Oct, 2013

PN-WSNA-Based Eye–Hand–Leg Coordination with a FIRA HuroCup Basketball Game

Authors: Kuo, C.-H., Chen, T.-S., Chou, H.-C., Chen, G.-Z.

Source: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 18(3):854-866 Jun, 2013

$e$ -Plus Solutions for a Bilateral Arm Trainer With Wireless Sensor Networks

Authors: Kuo, C.-H., Chen, C.-T., Chen, T.-S., Kuo, Y.-C.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 12(5):1214-1225 May, 2012

An Improved Reversible Data Hiding in Encrypted Images Using Side Match

Authors: Hong, W., Chen, T.-S., Wu, H.-Y.

Source: IEEE Signal Processing Letters IEEE Signal Process. Lett. Signal Processing Letters, IEEE. 19(4):199-202 Apr, 2012

A Novel Data Embedding Method Using Adaptive Pixel Pair Matching

Authors: Hong, W., Chen, T.-S.

Source: IEEE Transactions on Information Forensics and Security IEEE Trans.Inform.Forensic Secur. Information Forensics and Security, IEEE Transactions on. 7(1):176-184 Feb, 2012