Intermetallic Compounds For Interconnect Metal Beyond 3 nm Node

Authors: Koike, Junichi, Kuge, Toshihito, Chen, Linghan, Yahagi, Masataka

Source: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021

Relation: 2021 IEEE International Interconnect Technology Conference (IITC)

Possibility of Cu2Mg for Liner-Barrier Free Interconnects

Authors: Chen, Linghan, Ando, Daisuke, Sutou, Yuji, Yahagi, Masataka, Koike, Junichi

Source: 2020 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC),2020 IEEE International. :85-87 Oct, 2020

Relation: 2020 IEEE International Interconnect Technology Conference (IITC)

Down-regulation of miR-486-5p expression inhibits the proliferation and invasion of human extravillous trophoblasts, and decreased peripheral plasma miR-486-5p level is associated with human early pregnancy loss

Authors: Gu Yan, Song Ning, Gu Wen-Wen, Chen Linghan, Zhang Xuan, Wang Jian

Source: Acta Biochimica et Biophysica Sinica, Vol 55, Pp 1847-1850 (2023)

Subject Terms: Biochemistry, QD415-436, Genetics, QH426-470

File Description: electronic resource

Relation: https://doaj.org/toc/1672-9145

Access URL: https://doaj.org/article/51624f842ef84aa1b552eb060495f4a5

Toxic effects of calcein injection on juvenile silver carp Hypophthalmichthys molitrix

Authors: Lü, Hongjian, Wang, Zhengxi, Ding, Yuwei, Feng, Xue, Zhao, Chunxian, Chen, Linghan, Yao, Weizhi, Xi, Dan, Fu, Mei

Source: In Aquaculture 15 December 2022 561

Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges

Authors: Chen, Linghan, Chen, Qian, Ando, Daisuke, Sutou, Yuji, Kubo, Momoji, Koike, Junichi

Source: In Applied Surface Science 30 January 2021 537

Interdiffusion reliability and resistivity scaling of intermetallic compounds as advanced interconnect materials.

Authors: Chen, Linghan¹ (AUTHOR), Kumar, Sushant² (AUTHOR), Yahagi, Masataka¹ (AUTHOR), Ando, Daisuke¹ (AUTHOR), Sutou, Yuji¹ (AUTHOR), Gall, Daniel² (AUTHOR), Sundararaman, Ravishankar² (AUTHOR), Koike, Junichi¹ (AUTHOR)

Source: Journal of Applied Physics. 1/21/2021, Vol. 129 Issue 3, p1-9. 9p.

Subject Terms: *INTERMETALLIC compounds, *SEMICONDUCTOR devices, *CHEMICAL bonds, *THIN films, *CURVE fitting, *COPPER-tin alloys

Effects of calcein on the levels of antioxidant enzymes and lipid peroxidation in juvenile silver carp, Hypophthalmichthys molitrix.

Authors: Lü, Hongjian¹ (AUTHOR), Chen, Linghan¹ (AUTHOR), Xie, Zhenhui¹ (AUTHOR), Fu, Mei¹ (AUTHOR), Su, Shengqi¹ (AUTHOR) sushengqi@swu.edu.cn, Yao, Weizhi¹ (AUTHOR)

Source: Aquaculture Research. Apr2021, Vol. 52 Issue 4, p1767-1776. 10p.

Subject Terms: *SILVER carp, *PEROXIDATION, *LIPIDS, *ENZYMES, *REACTIVE oxygen species

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CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices.

Authors: Chen, Linghan, Ando, Daisuke, Sutou, Yuji, Koike, Junichi

Source: Journal of Vacuum Science & Technology: Part B-Nanotechnology & Microelectronics; May2019, Vol. 37 Issue 3, pN.PAG-N.PAG, 7p

Subject Terms: THIN films, SEMICONDUCTOR materials, SEMICONDUCTOR devices, DOWNSCALING (Climatology)

CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices.

Authors: Chen, Linghan¹, Ando, Daisuke¹, Sutou, Yuji¹, Koike, Junichi¹, koikej@material.tohoku.ac.jp

Source: Journal of Vacuum Science & Technology: Part B-Nanotechnology & Microelectronics; May2019, Vol. 37 Issue 3, pN.PAG-N.PAG, 7p

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Liner- and barrier-free NiAl metallization: A perspective from TDDB reliability and interface status.

Authors: Chen, Linghan¹ (AUTHOR), Ando, Daisuke¹ (AUTHOR), Sutou, Yuji¹ (AUTHOR), Yokogawa, Shinji² (AUTHOR), Koike, Junichi¹ (AUTHOR) koikej@material.tohoku.ac.jp

Source: Applied Surface Science. Dec2019, Vol. 497, pN.PAG-N.PAG. 1p.

Subject Terms: *RELIABILITY in engineering, *INTERFACIAL reactions, *ACTIVATION energy