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1Academic Journal
Authors: Chassagnoux, R., Jarnac, A., Elias, P.
Source: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 52(4):1417-1426 Apr, 2024
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2Conference
Authors: Chassagnoux, R., Bonifaci, N., Lesaint, O., Creusot, C., Girodet, A.
Source: 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) Electrical Insulation and Dielectric Phenomena (CEIDP), 2023 IEEE Conference on. :1-4 Oct, 2023
Relation: 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
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3Academic Journal
Source: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 30(4):1681-1689 Aug, 2023
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4Academic Journal
Source: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 30(4):1690-1697 Aug, 2023
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5Academic Journal
Authors: Chassagnoux, R., Lesaint, O., Bonifaci, N., Gallot-Lavallee, O., Flury, S., Palenzuela, J., Legendre, P., Escamez, G., Creusot, C., Girodet, A.
Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 29(5):1-5 Aug, 2019