Development and validation of prognostic nomogram for T1-3N0M0 non-small cell lung cancer after curative resection

Authors: Weijian Mei, Wang Yao, Zhengbo Song, Wenjie Jiao, Lianxin Zhu, Qinghua Huang, Chaolun An, Jianguang Shi, Guiping Yu, Pingli Sun, Yinbin Zhang, Jianfei Shen, Chunwei Xu, Han Yang, Qian Wang, Zhihua Zhu

Source: BMC Cancer, Vol 23, Iss 1, Pp 1-9 (2023)

Subject Terms: Non-small cell lung cancer, Nomogram, Curative resection, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282

File Description: electronic resource

Relation: https://doaj.org/toc/1471-2407

Access URL: https://doaj.org/article/5cd55e0cc8234cff91ffc29e8359064d

Robust Power System Forecasting-Aided State Estimation Based on Generalized Loss Cubature Kalman Filter

Authors: Chen, Shanmou, Wu, Jianxia, Zhang, Chaolun, Qiao, Xu, Li, Weiwei, Li, Liang, Long, Hongyu

Source: 2024 Boao New Power System International Forum - Power System and New Energy Technology Innovation Forum (NPSIF) Power System and New Energy Technology Innovation Forum (NPSIF), 2024 Boao New Power System International Forum -. :712-716 Dec, 2024

Relation: 2024 Boao New Power System International Forum - Power System and New Energy Technology Innovation Forum (NPSIF)

Denoising of Transmission Electron Microscopy Images for Atomic Defect Identification

Authors: Zhang, Shiyi, Zhang, Qing, Ran, Xu, Wu, Xing, Wang, Yan, Wang, Chaolun

Source: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) the Physical and Failure Analysis of Integrated Circuits (IPFA), 2024 IEEE International Symposium on. :01-05 Jul, 2024

Relation: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Applied Machine Learning for Enterprise SSDs Operating Curve Predictions

Authors: Zheng, Chaolun, Zhang, Hedan, Chen, Li, Ye, Ning

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-5 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Automatic Solder Joint Failure Mode Analysis Based on Dye & Pry Image Processing

Authors: Lu, Yinan, Zheng, Chaolun, Huang, Andrew, Lau, Sean, Ye, Ning, Yang, Bo

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1657-1661 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Multiinstitutional Lung Image Classification Using Privacy-Preserving Horizontal Federated Learning with Homomorphic Encryption

Authors: Cao, Desen, Wang, Can, Sun, Hao, Cao, Chaolun, Kang, Ming, Zheng, Hailin, Zhou, Shaosong, Guan, Xingze, Cao, Yuanyang, Tong, Qing

Source: 2023 IEEE International Conference on E-health Networking, Application & Services (Healthcom) E-health Networking, Application & Services (Healthcom), 2023 IEEE International Conference on. :131-136 Dec, 2023

Relation: 2023 IEEE International Conference on E-health Networking, Application & Services (Healthcom)

Real-Time Collision-Free Planning and Tracking Control for Multiple UAVs Based on Distributed Model Predictive Control

Authors: Dai, Shaowu, Zhao, Chaolun, Ding, Jianbo, Lv, Jiapeng, He, Yunfeng, Gu, Haolun

Source: 2023 China Automation Congress (CAC) Automation Congress (CAC), 2023 China. :4348-4355 Nov, 2023

Relation: 2023 China Automation Congress (CAC)

Research on Development of Data Disaster Recovery System

Authors: Tian, Jiafeng, Ma, Pengwei, Wang, Chaolun, Wang, Zhuo

Source: 2023 IEEE 22nd International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom) TRUSTCOM Trust, Security and Privacy in Computing and Communications (TrustCom), 2023 IEEE 22nd International Conference on. :2210-2215 Nov, 2023

Relation: 2023 IEEE 22nd International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom)

Research on the Construction of Information System Stability Guarantee Capability

Authors: Ma, Pengwei, Wang, Chaolun

Source: 2023 IEEE 22nd International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom) TRUSTCOM Trust, Security and Privacy in Computing and Communications (TrustCom), 2023 IEEE 22nd International Conference on. :2087-2091 Nov, 2023

Relation: 2023 IEEE 22nd International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom)

Research on Distributed Database Stability Testing Platform based on Chaos Engineering

Authors: Wang, Chaolun, Yang, Jiaxing, Han, Xiaolu, Ma, Jianrui, Liu, Siyuan, Ma, Pengwei

Source: 2023 IEEE 22nd International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom) TRUSTCOM Trust, Security and Privacy in Computing and Communications (TrustCom), 2023 IEEE 22nd International Conference on. :2092-2097 Nov, 2023

Relation: 2023 IEEE 22nd International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom)

Exploration of TEM sample preparation for GaN dislocations based on in situ FIB-SEM

Authors: Zhang, Zijian, Sheng, Zhiwei, Chen, Zhenghao, Shen, Jianfei, Luo, Chen, Wang, Chaolun, Yang, Xuelin, Wu, X., Li, Xiaomei

Source: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Deep Learning for Analysis of Two-Dimensional Materials in High-Resolution Transmission Electron Microscopy Image

Authors: Sheng, Zhiwei, Xie, Jing, Zhang, Shiyi, Zhang, Mingyang, Luo, Chen, Dong, Zuoyuan, Wang, Yan, Wu, Xing, Wang, Chaolun

Source: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Thermal stability of VSe2 investigated by in situ transmission electron microscope

Authors: Ye, Changqing, Liu, Dongming, Shen, Junhao, Bi, Hengchang, Wu, Xing, Wang, Chaolun

Source: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

A clear distinction and presence of Acropora aff. divaricata within Acropora cf. solitaryensis species complex along their biogeographic distribution in East Asia

Authors: Savanna Wenhua Chow, Chih-Hsun Chen, Du-Yang Tsai, Takuma Mezaki, Satoshi Kubota, Hernyi Justin Hsieh, Shashank Keshavmurthy, Chaolun Allen Chen

Source: Scientific Reports, Vol 15, Iss 1, Pp 1-16 (2025)

Subject Terms: Acropora, Species complex, Coral ecosystems in East Asia, Taiwan, Japan, High-latitude, Medicine, Science

File Description: electronic resource

Relation: https://doaj.org/toc/2045-2322

Access URL: https://doaj.org/article/994d16834ee8402f8ea1e4716bc964cc

Chromosome-level genome assembly of the intertidal lucinid clam Indoaustriella scarlatoi

Authors: Yang Guo, Zhaoshan Zhong, Nannan Zhang, Minxiao Wang, Chaolun Li

Source: Scientific Data, Vol 12, Iss 1, Pp 1-6 (2025)

Subject Terms: Science

File Description: electronic resource

Relation: https://doaj.org/toc/2052-4463

Access URL: https://doaj.org/article/90632fa204be4425be6a4652c6f8bbbb

Shallow-water mussels (Mytilus galloprovincialis) adapt to deep-sea environment through transcriptomic and metagenomic insights

Authors: Luyang Sun, Xiaolu Liu, Li Zhou, Hao Wang, Chao Lian, Zhaoshan Zhong, Minxiao Wang, Hao Chen, Chaolun Li

Source: Communications Biology, Vol 8, Iss 1, Pp 1-17 (2025)

Subject Terms: Biology (General), QH301-705.5

File Description: electronic resource

Relation: https://doaj.org/toc/2399-3642

Access URL: https://doaj.org/article/b22fb04823f44928af403f2b3645b7c0

Degenerated vision, altered lipid metabolism, and expanded chemoreceptor repertoires enable Lindaspio polybranchiata to thrive in deep-sea cold seeps

Authors: Yujie Yan, Inge Seim, Yang Guo, Xupeng Chi, Zhaoshan Zhong, Dantong Wang, Mengna Li, Haining Wang, Huan Zhang, Minxiao Wang, Chaolun Li

Source: BMC Biology, Vol 23, Iss 1, Pp 1-18 (2025)

Subject Terms: Deep-sea Polychaeta, Adaptive evolution, High hydrostatic pressure, Visual degeneration, Digestive enzymes, Chemoreceptors, Biology (General), QH301-705.5

File Description: electronic resource

Relation: https://doaj.org/toc/1741-7007

Access URL: https://doaj.org/article/875d30f01e014d1cb1e0153ce60508c8

Transmission Line Pulse Induced Breakdown of FinFETs

Authors: Yang, Xin, Qing, Yihong, Dong, Zuoyuan, Chang-Liao, Kuei-Shu, Qian, Yunhan, Zhang, Zijian, Liang, Fang, Luo, Chen, Wang, Chaolun, Liu, Zhiwei, Wu, Yongren, Tsai, Chihang, Wu, Xing

Source: 2022 International EOS/ESD Symposium on Design and System (IEDS) Design and System (IEDS), 2022 International EOS/ESD Symposium on. :1-4 Nov, 2022

Relation: 2022 International EOS/ESD Symposium on Design and System (IEDS)

Capacitive humidity sensors based on PVA/CAB compound film with potassium acetate-enhanced sensitivity

Authors: Yao, Songping, Zhang, Qia, Ding, Wentai, Zhang, Yonghua, Zhang, Jian, Wang, Chaolun

Source: 2022 15th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI) Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), 2022 15th International Congress on. :1-5 Nov, 2022

Relation: 2022 15th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI)

Reliability study of hydrogel-based flexible supercapacitor

Authors: Qiao, Yuchong, Wu, Xinyue, Wang, Chaolun, Wu, Xing

Source: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-4 Jul, 2022

Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)