Stacked Channel Transistors with 2D Materials: An Integration Perspective

Authors: Chung, Yun-Yan, Chou, Bo-Jhih, Yun, Wei-Sheng, Hsu, Chen-Feng, Yu, Shao-Ming, Chang, Yu-I, Lee, Chen-Yi, Chou, Sui-An, Ho, Po-Hsun, Wei, Aslan, Sathaiya, D. Mahaveer, Liu, Bo-Heng, Chen, Chien-Wei, Su, Chien-Ying, Kei, Chi-Chung, Hsueh, Fu-Kuo, Hou, Tuo-Hung, Chang, Wen-Hao, Cai, Jin, Wu, Chung-Cheng, Wu, Jeff, Woon, Wei-Yen, Lee, Tung-Ying, Chien, Chao-Hsin, Cheng, Chao-Ching, Radu, Iuliana P.

Source: 2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024

Relation: 2024 IEEE International Electron Devices Meeting (IEDM)

The tectonic bricolage of glass and steel architecture in Taiwan

Authors: Shih, Chih-ming, Chang, Yu-i

Source: 2011 International Conference on Consumer Electronics, Communications and Networks (CECNet) Consumer Electronics, Communications and Networks (CECNet), 2011 International Conference on. :1856-1862 Apr, 2011

Relation: 2011 International Conference on Consumer Electronics, Communications and Networks (CECNet)