(Late) Reliability and performance considerations for NMOSFET pass gates in FPGA applications

Authors: Kaczer, B., Chen, C. S., Watt, J. T., Chanda, K., Weckx, P., Luque, M. Toledano, Groeseneken, G., Grasser, T.

Source: 2013 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International. :94-97 Oct, 2013

Relation: 2013 IEEE International Integrated Reliability Workshop (IIRW)

Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects

Authors: Yang, C.-C., Spooner, T., Ponoth, S., Chanda, K., Simon, A., Lavoie, C., Lane, M., Hu, C.-K., Liniger, E., Gignac, L., Shaw, T., Cohen, S., McFeely, F., Edelstein, D.

Source: 2006 International Interconnect Technology Conference Interconnect Technology Conference, 2006 International. :187-190 2006

Relation: 2006 International Interconnect Technology Conference

Investigation of CVD SiCOH low-k time-dependent dielectric breakdown at 65nm node technology

Authors: Chen, F., Chanda, K., Gill, J., Angyal, M., Demarest, J., Sullivan, T., Kontra, R., Shinosky, M., Li, J., Economikos, L., Hoinkis, M., Lane, S., McHerron, D., Inohara, M., Boettcher, S., Dunn, D., Fukasawa, M., Zhang, B.C., Ida, K., Ema, T., Lembach, G., Kumar, K., Lin, Y., Maynard, H., Urata, K., Bolom, T., Inoue, K., Smith, J., Ishikawa, Y., Naujok, M., Ong, P., Sakamoto, A., Hunt, D., Aitken, J.

Source: 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. Reliability physics Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International. :501-507 2005

Relation: 2005 IEEE International Reliability Physics Symposium. Proceedings 43rd Annual

Interconnection requirements and multi-die integration for FPGAs

Authors: Rahman, A., Schulz, J., Grenier, R., Chanda, K., Lee, M. J., Ratakonda, D., Shi, H., Li, Z., Chandrasekar, K., Xie, J., Ibbotson, D.

Source: 2013 IEEE International Interconnect Technology Conference - IITC Interconnect Technology Conference (IITC), 2013 IEEE International. :1-3 Jun, 2013

Relation: 2013 IEEE International Interconnect Technology Conference - IITC

Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL

Authors: Edelstein, D., Rathore, H., Davis, C., Clevenger, L., Cowley, A., Nogami, T., Agarwala, B., Arai, S., Carbone, A., Chanda, K., Chen, F., Cohen, S., Cote, W., Cullinan, M., Dalton, T., Das, S., Davis, P., Demarest, J., Dunn, D., Dziobkowski, C., Filippi, R., Fitzsimmons, J., Flaitz, P., Gates, S., Gill, J., Grill, A., Hawken, D., Ida, K., Klaus, D., Klymko, N., Lane, M., Lane, S., Lee, J., Landers, W., Li, W.-K., Lin, Y.-H., Liniger, E., Liu, X.-H., Madan, A., Malhotra, S., Martin, J., Molis, S., Muzzy, C., Nguyen, D., Nguyen, S., Ono, M., Parks, C., Questad, D., Restaino, D., Sakamoto, A., Shaw, T., Shimooka, Y., Simon, A., Simonyi, E., Swift, A., Van Kleeck, T., Vogt, S., Wang, Y.-Y., Wille, W., Wright, J., Yang, C.-C., Yoon, M., Ivers, T.

Source: 2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :316-319 2004

Relation: 2004 IEEE International Reliability Physics Symposium. Proceedings

New Class of Trimetallic Oxide Hierarchical Mesoporous Array on Woven Fabric: Electrode for high-Performance and Stable battery type Ultracapacitor

Authors: Thakur, S., Maiti, S., Sardar, K., Besra, N., Bairi, P., Panigrahi, K., Chanda, K., Paul, T., Chattopadhyay, K.K.

Source: In Journal of Energy Storage March 2021 35

Correlation of eGFR By MDRD and CKD-EPI Formula with Creatinine Clearance Estimation in CKD Patients and Healthy Subjects

Authors: Das, S. K., Roy, D. K., Chowdhury, A. A., Roy, A. S., Ahammed, S. U., Asadujjaman, M., Rabbani, M. G., Islam, M. S., Barman, G. C., Chanda, K.

Source: Mymensingh medical journal. 30(1):35-42

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN629005662&indx=1&recIds=ETOCRN629005662

A BEOL multilevel structure with ultra low-k materials (k ≤ 2.4)

Authors: Bao, J., Lustig, N., Engbrecht, E., Gill, J., Filippi, R., Lee, T. C., Chanda, K., Kioussis, D., Lisi, A., Cheng, T., Law, S. B., Simon, A., Flaitz, P., Choi, J., Tseng, W., Zielinski, E., Gates, S. M., Grill, A., Nguyen, S., Shobha, H.

Source: 2010 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2010 International. :1-3 Jun, 2010

Relation: 2010 IEEE International Interconnect Technology Conference - IITC

Muskrat distributions in a changing Arctic delta are explained by patch composition and configuration

Authors: Chanda K. Turner, Trevor C. Lantz, Jason T. Fisher

Source: Arctic Science, Vol 6, Iss 2, Pp 77-94 (2020)

Subject Terms: arctic, muskrat, heterogeneity, mackenzie delta, hydrology, Environmental sciences, GE1-350, Environmental engineering, TA170-171

File Description: electronic resource

Relation: https://doaj.org/toc/2368-7460

Access URL: https://doaj.org/article/ecb9aced091e42529ee7357770af4235

BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65 nm groundrules

Authors: Fukasawa, M., Lane, S., Angyal, M., Chanda, K., Chen, F., Christiansen, C., Fitzsimmons, J., Gill, J., Ida, K., Inoue, K., Kumar, K., Li, B., McLaughlin, P., Melville, I., Minami, M., Nguyen, S., Penny, C., Sakamoto, A., Shimooka, Y., Ono, M., McHerron, D., Nogami, T., Ivers, T.

Source: Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. Interconnect technology Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International. :9-11 2005

Relation: Proceedings of the IEEE 2005 International Interconnect Technology Conference

Extendibility of PVD barrier/seed for BEOL Cu metallization

Authors: Yang, C.-C., Edelstein, D., Clevenger, L., Cowley, A., Gill, J., Chanda, K., Simon, A., Dalton, T., Agarwala, B., Cooney, E., III, Nguyen, D., Spooner, T., Stamper, A.

Source: Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. Interconnect technology Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International. :135-137 2005

Relation: Proceedings of the IEEE 2005 International Interconnect Technology Conference

Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology

Authors: Edelstein, D., Davis, C., Clevenger, L., Yoon, M., Cowley, A., Nogami, T., Rathore, H., Agarwala, B., Arai, S., Carbone, A., Chanda, K., Cohen, S., Cote, W., Cullinan, M., Dalton, T., Das, S., Davis, P., Demarest, J., Dunn, D., Dziobkowski, C., Filippi, R., Fitzsimmons, J., Flaitz, P., Gates, S., Gill, J., Grill, A., Hawken, D., Ida, K., Klaus, D., Klymko, N., Lane, M., Lane, S., Lee, J., Landers, W., Li, W.-K., Lin, Y.-H., Liniger, E., Liu, X.-H., Madan, A., Malhotra, S., Martin, J., Molis, S., Muzzy, C., Nguyen, D., Nguyen, S., Ono, M., Parks, C., Questad, D., Restaino, D., Sakamoto, A., Shaw, T., Shimooka, Y., Simon, A., Simonyi, E., Tempest, S., Van Kleeck, T., Vogt, S., Wang, Y.-Y., Wille, W., Wright, J., Yang, C.-C., Ivers, T.

Source: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :214-216 2004

Relation: Proceedings of the IEEE 2004 International Interconnect Technology Conference

Integration and reliability of CVD Ru cap for Cu/Low-k development

Authors: Yang, C.-C., Edelstein, D., Chanda, K., Wang, P., Hu, C.-K., Liniger, E., Cohen, S., Lloyd, J.R., Li, B., McFeely, F., Wisnieff, R., Ishizaka, T., Cerio, F., Suzuki, K., Rullan, J., Selsley, A., Jomen, M.

Source: 2009 IEEE International Interconnect Technology Conference Interconnect Technology Conference, 2009. IITC 2009. IEEE International. :255-257 Jun, 2009

Relation: 2009 IEEE International Interconnect Technology Conference - IITC

Estimation of short circuit capability of Generator Circuit Breaker for a generator fed fault

Authors: Chanda, K., Parthasarathi, R., Holla, S.

Source: 2008 IEEE/PES Transmission and Distribution Conference and Exposition: Latin America Transmission and Distribution Conference and Exposition: Latin America, 2008 IEEE/PES. :1-4 Aug, 2008

Relation: 2008 IEEE/PES Transmission and Distribution Conference & Exposition: Latin America

Determination of interrupting ratings of MV switchgear breakers for power plant applications by IEEE methods

Authors: Parthasarathi, R., Kim, Y., Chanda, K.

Source: 2008 IEEE/PES Transmission and Distribution Conference and Exposition: Latin America Transmission and Distribution Conference and Exposition: Latin America, 2008 IEEE/PES. :1-4 Aug, 2008

Relation: 2008 IEEE/PES Transmission and Distribution Conference & Exposition: Latin America

Line edge roughness and spacing effect on low-k TDDB characteristics

Authors: Chen, F., Lloyd, J. R., Chanda, K., Achanta, R., Bravo, O., Strong, A., McLaughlin, P. S., Shinosky, M., Sankaran, S., Gebreselasie, E., Stamper, A. K., He, Z.X.

Source: 2008 IEEE International Reliability Physics Symposium Reliability Physics Symposium, 2008. IRPS 2008. IEEE International. :132-137 Apr, 2008

Relation: 2008 IEEE International Reliability Physics Symposium (IRPS)

A Pose Recovery Algorithm to Minimize the Effects of Pose Variation on the Matching Performance of Elastic Bunch Graph Based Multiview Face Recognition System

Authors: Mazumdar, D., Chanda, K., Bhattacharya, M., Mitra, S.

Source: 2007 International Conference on Computing: Theory and Applications (ICCTA'07) Computing: Theory and Applications, 2007. ICCTA '07. International Conference on. :377-381 Mar, 2007

Relation: 2007 International Conference on Computing: Theory and Applications

Characterization of time-dependent variability using 32k transistor arrays in an advanced HK/MG technology

Authors: Weckx, P., Kaczer, B., Chen, C., Franco, J., Bury, E., Chanda, K., Watt, J., Roussel, Ph. J., Catthoor, F., Groeseneken, G.

Source: 2015 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2015 IEEE International. :3B.1.1-3B.1.6 Apr, 2015

Relation: 2015 IEEE International Reliability Physics Symposium (IRPS)

Assessment of Indications and Complications of Caesarean Section in A Private Medical College Hospital of Bangladesh

Authors: Akhter, H., Sen, S., Talukder, R. K., Busreea, R. A., Chanda, K., Yasmin, M., Roy, A. R., Rubi, N. A., Banu, U. S., Khatun, M. S.

Source: Mymensingh medical journal. 29(4):756-763

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN625355990&indx=1&recIds=ETOCRN625355990

A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology

Authors: Sankaran, S., Arai, S., Augur, R., Beck, M., Biery, G., Bolom, T., Bonilla, G., Bravo, O., Chanda, K., Chae, M., Chen, F., Clevenger, L., Cohen, S., Cowley, A., Davis, P., Demarest, J., Doyle, J., Dimitrakopoulos, C., Economikos, L., Edelstein, D., Farooq, M., Filippi, R., Fitzsimmons, J., Fuller, N., Gates, S. M., Greco, S. E., Grill, A., Grunow, S., Hannon, R., Ida, K., Jung, D., Kaltalioglu, E., Kelling, M., Ko, T., Kumar, K., Labelle, C., Landis, H., Lane, M.W., Landers, W., Lee, M., Li, W., Liniger, E., Liu, X., Lloyd, J. R., Liu, W., Lustig, N., Malone, K., Marokkey, S., Matusiewicz, G., McLaughlin, P. S., McLaughlin, P. V., Mehta, S., Melville, I., Miyata, K., Moon, B., Nitta, S., Nguyen, D., Nicholson, L., Nielsen, D., Ong, P., Patel, K., Patel, V., Park, W., Pellerin, J., Ponoth, S., Petrarca, K., Rath, D., Restaino, D., Rhee, S., Ryan, E.T., Shoba, H., Simon, A., Simonyi, E., Shaw, T.M., Spooner, T., Standaert, T., Sucharitaves, J., Tian, C., Wendt, H., Werking, J., Widodo, J., Wiggins, L., Wisnieff, R., Ivers, T.

Source: 2006 International Electron Devices Meeting Electron Devices Meeting, 2006. IEDM '06. International. :1-4 Dec, 2006

Relation: 2006 International Electron Devices Meeting