Showing 1 - 20 results of 1,014 Refine Results
  1. 1
    Conference

    “Ship Lock” Thermal Design of Power Chip Packaging and Its Effects on Thermal Performance and Reliability Based on Dimensional Parameters

    Authors: Su, Baorong, Cai, Miao, Yang, Daoguo

    Source: 2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) Soli State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), 2024 21st China International Forum on. :153-159 Nov, 2024

    Relation: 2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)

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  2. 2
    Conference

    Research on High Thermal Conductivity Silver Sintering Interconnection Process and Heat Dissipation Performance of High-Power UV-LED Packaging Chips

    Authors: Guo, Yuxuan, Cai, Miao, Chen, Hao, Yang, Daoguo

    Source: 2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) Soli State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), 2024 21st China International Forum on. :401-406 Nov, 2024

    Relation: 2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)

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  3. 3
    Conference

    RSCache: A Tail Latency Friendly Cache Based on NVMe SSDs

    Authors: Lu, Jincheng, Cai, Miao, Ye, Baoliu

    Source: 2024 IEEE International Symposium on Parallel and Distributed Processing with Applications (ISPA) ISPA Parallel and Distributed Processing with Applications (ISPA), 2024 IEEE International Symposium on. :1265-1272 Oct, 2024

    Relation: 2024 IEEE International Symposium on Parallel and Distributed Processing with Applications (ISPA)

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  4. 4
    Conference

    CK-index: A Distribution-Aware Learned Index for Composite Keys

    Authors: Wei, Zhengyang, Ye, Baoliu, Cai, Miao

    Source: 2024 IEEE International Symposium on Parallel and Distributed Processing with Applications (ISPA) ISPA Parallel and Distributed Processing with Applications (ISPA), 2024 IEEE International Symposium on. :1798-1804 Oct, 2024

    Relation: 2024 IEEE International Symposium on Parallel and Distributed Processing with Applications (ISPA)

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  5. 5
    Conference

    Characterization Analysis for High-Temperature Evolution Features of Fine Silver Sintered Joints

    Authors: Zhang, Yuting, Cai, Miao, Guo, Yuxuan, Hu, Xiaokai, Liu, Dongjing, Han, Shunfeng

    Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    Conference

    Dynamic Pin Pulling Modeling for the Micro-Pads of High Density Packaging Substrate

    Authors: Chen, Hao, Cai, Miao, Guo, Yuxuan, Liu, Dongjing, Yang, Daoguo, Li, Bofu

    Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    Conference

    A CNN-Based Approach Combining Temporal Shift Module and Attention for Motor Imagery Classification

    Authors: Cai, Miao, Zeng, Yu

    Source: 2024 7th International Conference on Advanced Algorithms and Control Engineering (ICAACE) Advanced Algorithms and Control Engineering (ICAACE), 2024 7th International Conference on. :329-332 Mar, 2024

    Relation: 2024 7th International Conference on Advanced Algorithms and Control Engineering (ICAACE)

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  8. 8
    Report

    Mask-Encoded Sparsification: Mitigating Biased Gradients in Communication-Efficient Split Learning

    Authors: Zhou, Wenxuan, Qu, Zhihao, Lyu, Shen-Huan, Cai, Miao, Ye, Baoliu

    Source: Proceedings of the 27th European Conference on Artificial Intelligence, 2024

    Subject Terms: Computer Science - Machine Learning, Computer Science - Distributed, Parallel, and Cluster Computing

    Access URL: http://arxiv.org/abs/2408.13787

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  9. 9
    Report

    Quantum Cross Nonlinearity for Photon-Number-Resolving Nondestructive Detection

    Authors: Tang, Jiang-Shan, Chen, Mingyuan, Cai, Miao, Tang, Lei, Lu, Yanqing, Xia, Keyu, Nori, Franco

    Subject Terms: Quantum Physics

    Access URL: http://arxiv.org/abs/2408.07870

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  10. 10
    Report

    High-Dimensional Two-Photon Quantum Controlled Phase-Flip Gate

    Authors: Chen, Mingyuan, Tang, Jiangshan, Cai, Miao, Nori, Franco, Xia, Keyu

    Subject Terms: Quantum Physics, Physics - Optics

    Access URL: http://arxiv.org/abs/2404.14673

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  11. 11
    Report

    Nonreciprocal PT-symmetric phase transition in a non-Hermitian chiral quantum optical system

    Authors: Cai, Miao, Tang, Jiang-Shan, Chen, Ming-Yuan, Xia, Keyu

    Subject Terms: Quantum Physics

    Access URL: http://arxiv.org/abs/2404.12860

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  12. 12
    Report

    Photonic indistinguishability characterization and optimization for cavity-based single-photon source

    Authors: Cai, Miao, Chen, Mingyuan, Tang, Jiangshan, Xia, Keyu

    Subject Terms: Quantum Physics

    Access URL: http://arxiv.org/abs/2404.11193

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  13. 13
    Conference

    High-Order Fully Actuated Systems: Tolerating Multiplicative Actuator Faults

    Authors: Cai, Miao, He, Xiao, Zhou, Donghua

    Source: 2023 CAA Symposium on Fault Detection, Supervision and Safety for Technical Processes (SAFEPROCESS) Fault Detection, Supervision and Safety for Technical Processes (SAFEPROCESS), 2023 CAA Symposium on. :1-6 Sep, 2023

    Relation: 2023 CAA Symposium on Fault Detection, Supervision and Safety for Technical Processes (SAFEPROCESS)

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  14. 14
    Conference

    Sensor Fault Tolerance for High-order Fully-actuated Systems

    Authors: Cai, Miao, He, Xiao, Zhou, Donghua

    Source: 2023 2nd Conference on Fully Actuated System Theory and Applications (CFASTA) Fully Actuated System Theory and Applications (CFASTA), 2023 2nd Conference on. :403-408 Jul, 2023

    Relation: 2023 2nd Conference on Fully Actuated System Theory and Applications (CFASTA)

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  15. 15
    Report

    Generation of True Quantum Random Numbers with On-Demand Probability Distributions via Single-Photon Quantum Walks

    Authors: Meng, Chaoying, Cai, Miao, Yang, Yufang, Wu, Haodong, Li, Zhixiang, Ruan, Yaping, Zhang, Yong, Zhang, Han, Xia, Keyu, Nori, Franco

    Subject Terms: Quantum Physics, Physics - Optics

    Access URL: http://arxiv.org/abs/2403.02614

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  16. 16
    Conference

    Improving Write Performance for LSM-tree-based Key-Value Stores with NV-Cache

    Authors: Jiang, Xuzhen, Cai, Miao, Ye, Baoliu

    Source: 2022 IEEE Intl Conf on Parallel & Distributed Processing with Applications, Big Data & Cloud Computing, Sustainable Computing & Communications, Social Computing & Networking (ISPA/BDCloud/SocialCom/SustainCom) ISPA-BDCLOUD-SOCIALCOM-SUSTAINCOM Parallel & Distributed Processing with Applications, Big Data & Cloud Computing, Sustainable Computing & Communications, Social Computing & Networking (ISPA/BDCloud/SocialCom/SustainCom), 2022 IEEE Intl Conf on. :394-401 Dec, 2022

    Relation: 2022 IEEE Intl Conf on Parallel & Distributed Processing with Applications, Big Data & Cloud Computing, Sustainable Computing & Communications, Social Computing & Networking (ISPA/BDCloud/SocialCom/SustainCom)

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  17. 17
    Conference

    SigGuard: Hardening Vulnerable Signal Handling in Commodity Operating Systems

    Authors: Cai, Miao, Shen, Junru, Zhang, Tianning, Huang, Hao, Ye, Baoliu

    Source: 2022 41st International Symposium on Reliable Distributed Systems (SRDS) SRDS Reliable Distributed Systems (SRDS), 2022 41st International Symposium on. :237-249 Sep, 2022

    Relation: 2022 41st International Symposium on Reliable Distributed Systems (SRDS)

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  18. 18
    Conference

    Inactivation of Escherichia coli and Staphylococcus aureus by using a UVC-LED module with a multi-wavelength setting

    Authors: Lu, Zhiwei, Li, Xiaoling, Wei, Jinxiu, Cai, Miao, Yang, Daoguo, Zhang, Guoqi

    Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  19. 19
    Conference

    Thermal and stress performance analysis of double-sided cooling power module based on voids in different solder layers

    Authors: Wang, Xinhai, Cai, Miao, Li, Xiaojun, Yang, Daoguo, Li, Hao, Zhang, Jie

    Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  20. 20
    Conference

    Research on optical and thermal properties of 3D ceramic substrate LED package

    Authors: Chen, Xindong, Cai, Miao, Yang, Daoguo, He, Hengjian, Zheng, Dan, He, Mingzhuang

    Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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