Experimental Demonstration of Point-Injection Trench IGBT Concept

Authors: Buitrago, Elizabeth, Antoniou, Marina, Schneider, Nick, Bianda, Enea, De-Michielis, Luca, Corvasce, Chiara, Udrea, Florin

Source: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2023 35th International Symposium on. :179-182 May, 2023

Relation: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Pushing the Limits of the Maximum Punch-Through Design with an Advanced Buffer for Thin Wafer IGBTs

Authors: Buitrago, Elizabeth, Schneider, Nick, Corvasce, Chiara, Vobecky, Jan, De-Michielis, Luca, Rahimo, Munaf

Source: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2020 32nd International Symposium on. :509-512 Sep, 2020

Relation: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)

A Critical View of IGBT Buffer Designs for 200 °C Operation

Authors: Buitrago, Elizabeth, Mesemanolis, Athanasios, Andenna, Maxi, Papadopoulos, Charalampos, Corvasce, Chiara, Vobecky, Jan, Rahimo, Munaf

Source: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2019 31st International Symposium on. :47-50 May, 2019

Relation: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)

An advanced soft punch through buffer design for thin wafer IGBTs targeting lower losses and higher operating temperatures up to 200 °C

Authors: Buitrago, Elizabeth, Mesemanolis, Athanasios, Papadopoulos, Charalampos, Corvasce, Chiara, Vobecky, Jan, Rahimo, Munaf

Source: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2018 IEEE 30th International Symposium on. :499-502 May, 2018

Relation: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

1.2 kV Trench IGBT with SiC JBS Diode for High Frequency Switching Applications
International exhibition and conference for power electronics, intelligent motion, renewable energy and energy management (PCIM Europe 2022)

Authors: Schneider, Nick, Buitrago, Elizabeth, Arango, Yulieth, Oliva, Nicolo, Ruiz, Toni, De Michielis, Luca, Knoll, Lars, Paques, Gontran

Source: PCIM power electronics conference. 2:1082-1087

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607747098&indx=1&recIds=ETOCCN607747098

Next Generation LV Trench IGBT Design Featuring Plasma-Flow Control for Improved Switching Losses and Turn-on dV/dt Controllability
International exhibition and conference for power electronics, intelligent motion, renewable energy and energy management (PCIM Europe 2022)

Authors: Gupta, Gaurav, Buitrago, Elizabeth, Schneider, Nick, Vitale, Wolfgang, De Michielis, Luca

Source: PCIM power electronics conference. 1:203-209

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607745911&indx=1&recIds=ETOCCN607745911

Next Generation 1.7 kV Chipset: Fine-Pattern Trench IGBT and Ultra-Thin FSA Diode for Traction Applications
International exhibition and conference for power electronics, intelligent motion, renewable energy and energy management (PCIM Europe 2022)

Authors: Vitale, Wolfgang Amadeus, Paques, Gontran, Boksteen, Boni, Gupta, Gaurav, Ruiz, Antoni, Oliva, Nicolò, De Michielis, Luca, Buitrago, Elizabeth, Schneider, Nick

Source: PCIM power electronics conference. 1:210-214

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607745922&indx=1&recIds=ETOCCN607745922

RUGGED LV TRENCH IGBT WITH EXTREME STABILITY IN CONTINUOUS SOA OPERATION: NEXT GENERATION LV TECHNOLOGY AT HITACHI ABB POWERGRIDS
Power electronics, intelligent motion, renewable energy and energy management International conference, PCIM

Authors: Buitrago, Elizabeth, Schneider, Nick, Vitale, Wolfgang, Gupta, Gaurav, DeMichielis, Luca

Source: PCIM power electronics conference. 3:1574-1580

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607069072&indx=1&recIds=ETOCCN607069072

Long-term electrical stability of next generation LV Trench IGBT at Hitachi ABB Power Grids

Authors: Schneider, Nick, Buitrago, Elizabeth, Vitale, Wolfgang, De-Michielis, Luca

Source: In Microelectronics Reliability November 2021 126

Attomolar streptavidin and pH, low power sensor based on 3D vertically stacked SiNW FETs

Authors: Buitrago, Elizabeth, Fernandez-Bolanos, Montserrat, Georgiev, Yordan M., Ran Yu, Lotty, Olan, Holmes, Justin D., Nightingale, Adrian M., Ionescu, Adrian M.

Source: Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on. :1-2 Apr, 2014

Relation: 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

The Third Generation 6.5 kV HiPak2 Module Rated 1000 A and 150 °C
Power electronics, intelligent motion, renewable energy and energy management (International conference)

Authors: Papadopoulos, Charalampos, Boksteen, Boni, Andenna, Maxi, Buitrago, Elizabeth, Hartmann, Samuel, Matthias, Sven, Corvasce, Chiara, Kopta, Arnost, Vemulapati, Umamaheswara, Pâques, Gontran

Source: PCIM power electronics conference. 1:273-280

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN604010067&indx=1&recIds=ETOCCN604010067

Functionalized 3D 7×20-array of vertically stacked SiNW FET for streptavidin sensing

Authors: Buitrago, Elizabeth, Badia, Montserrat Fernandez-Bolanos, Georgiev, Yordan M., Yu, Ran, Lotty, Olan, Holmes, Justin D., Nightingale, Adrian M., Ionescu, Adrian M.

Source: 71st Device Research Conference Device Research Conference (DRC), 2013 71st Annual. Supplement:1-2 Jun, 2013

Relation: 2013 71st Annual Device Research Conference (DRC)

Soft-punch-through buffer concept for 600–1200 V IGBTs

Authors: Andenna, Maxi, Buitrago, Elizabeth, Corvasce, Chiara, Papadopoulos, Charalampos, Jabrany, Rachid, Rahimo, Munaf

Source: IET power electronics. 12(15):3874-3881

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100094393475.0x000001&indx=1&recIds=ETOCvdc_100094393475.0x000001

Patterning of nanodot-arrays using EUV achromatic Talbot lithography at the Swiss Light Source and Shanghai Synchrotron Radiation Facility

Authors: Fan, Daniel, Buitrago, Elizabeth, Yang, Shumin, Karim, Waiz, Wu, Yanqing, Tai, Renzhong, Ekinci, Yasin

Source: In Microelectronic Engineering 2 April 2016 155:55-60

SnOx high-efficiency EUV interference lithography gratings towards the ultimate resolution in photolithography

Authors: Buitrago, Elizabeth, Fallica, Roberto, Fan, Daniel, Kulmala, Tero S., Vockenhuber, Michaela, Ekinci, Yasin

Source: In Microelectronic Engineering 2 April 2016 155:44-49

Pattern collapse mitigation in inorganic resists via a polymer freeze technique

Authors: Kulmala, Tero S., Buitrago, Elizabeth, Vockenhuber, Michaela, Ekinci, Yasin

Source: In Microelectronic Engineering 2 April 2016 155:39-43

Carbon nanotube gas sensor array for multiplex analyte discrimination

Authors: Guerin, Hoël, Le Poche, Hélène, Pohle, Roland, Buitrago, Elizabeth, Fernández-Bolaños Badía, Montserrat, Dijon, Jean, Ionescu, Adrian M.

Source: In Sensors & Actuators: B. Chemical February 2015 207 Part A:833-842

High-yield, in-situ fabrication and integration of horizontal carbon nanotube arrays at the wafer scale for robust ammonia sensors

Authors: Guerin, Hoël, Le Poche, Hélène, Pohle, Roland, Syavoch Bernard, Laurent, Buitrago, Elizabeth, Ramos, Raphaël, Dijon, Jean, Ionescu, Adrian M.

Source: In Carbon November 2014 78:326-338

Electrical characterization of high performance, liquid gated vertically stacked SiNW-based 3D FET biosensors

Authors: Buitrago, Elizabeth, Badia, Montserrat Fernández-Bolaños, Georgiev, Yordan M., Yu, Ran, Lotty, Olan, Holmes, Justin D., Nightingale, Adrian M., Guerin, Hoël M., Ionescu, Adrian M.

Source: In Sensors & Actuators: B. Chemical August 2014 199:291-300

The top-down fabrication of a 3D-integrated, fully CMOS-compatible FET biosensor based on vertically stacked SiNWs and FinFETs

Authors: Buitrago, Elizabeth, Fernández-Bolaños, Montserrat, Rigante, Sara, Zilch, Christian F., Schröter, Nicole S., Nightingale, Adrian M., Ionescu, Adrian M.

Source: In Sensors & Actuators: B. Chemical 31 March 2014 193:400-412