Integration of Deep Learning Network and Robot Arm System for Rim Defect Inspection Application

Authors: Wei-Lung Mao, Yu-Ying Chiu, Bing-Hong Lin, Chun-Chi Wang, Yi-Ting Wu, Cheng-Yu You, Ying-Ren Chien

Source: Sensors, Vol 22, Iss 10, p 3927 (2022)

Subject Terms: robotic arm, rim defect detection, YOLO algorithm, deep convolutional generative adversarial networks (DCGAN), Chemical technology, TP1-1185

File Description: electronic resource

Relation: https://www.mdpi.com/1424-8220/22/10/3927; https://doaj.org/toc/1424-8220

Access URL: https://doaj.org/article/865a329ccd4c46c3bd83d17cc40a0911

Direct Fuzzy CMAC Sliding Mode Trajectory Tracking for Biaxial Position System

Authors: Wei-Lung Mao, Yu-Ying Chiu, Bing-Hong Lin, Wei-Cheng Sun, Jian-Fu Tang

Source: Energies, Vol 14, Iss 22, p 7802 (2021)

Subject Terms: direct fuzzy cmac sliding mode control (DFCMACSMC), permanent magnet synchronous motor (PMSM), precision motion control, position feedback sensor, trajectory tracking control, Technology

File Description: electronic resource

Relation: https://www.mdpi.com/1996-1073/14/22/7802; https://doaj.org/toc/1996-1073

Access URL: https://doaj.org/article/3f46df5e8e5c41d28c7ef84bf1da1ab3

Comparison of H2 and NH3 Treatments for Copper Interconnects

Authors: Yu-Min Chang, Jihperng Leu, Bing-Hong Lin, Ying-Lung Wang, Yi-Lung Cheng

Source: Advances in Materials Science and Engineering, Vol 2013 (2013)

Subject Terms: Materials of engineering and construction. Mechanics of materials, TA401-492

File Description: electronic resource

Relation: https://doaj.org/toc/1687-8434; https://doaj.org/toc/1687-8442

Access URL: https://doaj.org/article/db9cd28d228b46a38711884150ef15c9

Reliability of VLSI-level chip assembly for evaluating the development of back-end technologies using a test chip with a top two-level metal structure

Authors: Kuo-Yu Chou, Ming-Jer Chen, Chi-Wen Liu, Bing-Hong Lin

Source: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 2(3):50-59 Sep, 2002

Dynamic Sliding Mode Backstepping Control for Vertical Magnetic Bearing System.

Authors: Wei-Lung Mao¹, wlmao@yuntech.edu.tw, Yu-Ying Chiu¹, Chao-Ting Chu², Bing-Hong Lin¹, Jian-Jie Hung³

Source: Intelligent Automation & Soft Computing; 2022, Vol. 32 Issue 2, p923-936, 14p

Comparison of H2 and NH3 Treatments for Copper Interconnects.

Authors: Yu-Min Chang, Jihperng Leu, Bing-Hong Lin, Ying-Lung Wang, Yi-Lung Cheng

Source: Advances in Materials Science & Engineering; 2013, p1-7, 7p

Subject Terms: AMMONIA, COPPER, COPPER oxide, ELECTRODIFFUSION, ADHESION