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1Conference
Authors: Daval, N., Drouin, A., Biard, H., Viravaux, L., Radisson, D., Rouchier, S., Gaudin, G., Widiez, J., Allibert, F., Rolland, E., Vladimirova, K., Gelineau, G., Troutot, N., Navone, C., Berre, G., Bosch, D., Leow, Y.L, Duboust, A., Bethoux, J-M., Boulet, R., Chapelle, A., Cela, E., Lavaitte, G., Bouville-Lallart, A., Bhargava, S., Schwarzenbach, W., Maddalon, C., Radu, I., Odoul, S., Delprat, D., Bonnin, O., Maleville, C.
Source: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :85-87 Mar, 2022
Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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2Conference
Authors: Schwarzenbach, W., Rouchier, S., Berre, G., Boulet, R., Ledoux, O., Cela, E., Drouin, A., Chapelle, A., Monnoye, S., Biard, H., Alassaad, K., Viravaux, L., Mohamed, N. Ben, Radisson, D., Picun, G., Lavaitte, G., Bouville-Lallart, A., Roi, J., Widiez, J., Abadie, K., Rolland, E., Fournel, F., Gelineau, G., Mazen, F., Moulin, A., Moulin, C., Delprat, D., Daval, N., Odoul, S., Sandri, P., Maleville, C.
Source: 2022 International Conference on IC Design and Technology (ICICDT) IC Design and Technology (ICICDT), 2022 International Conference on. :55-56 Sep, 2022
Relation: 2022 International Conference on IC Design and Technology (ICICDT)
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3Periodical
Authors: Biard, H., Odoul, S., Schwarzenbach, W., Radu, I., Maleville, C., Potier, A., Ferrato, M., Guajioty, E.
Source: Diffusion and defect data.Pt. B, Solid state phenomena. 344:47-52
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4Academic Journal
Authors: Godfrin, C.1, Lumetti, S.2,3, Biard, H.1, Bonet, E.1, Klyatskaya, S.4, Ruben, M.4,5, Candini, A.2,6, Affronte, M.2,3, Wernsdorfer, W.1,4,7, Balestro, F.1,8
Source: Journal of Applied Physics; 2019, Vol. 125 Issue 14, pN.PAG-N.PAG, 8p, 1 Diagram, 3 Graphs