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    Conference

    Source: 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on. :1-4 Apr, 2013

    Relation: 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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    Academic Journal

    Authors: Alexandre, Lucile1,2 (AUTHOR) lucile.alexandre@curie.fr, Bendali, Amel1,2 (AUTHOR), Pereiro, Iago1,2 (AUTHOR), Azimani, Madad1,2 (AUTHOR), Dumas, Simon1,2 (AUTHOR), Malaquin, Laurent3 (AUTHOR), Mai, Thanh Duc4 (AUTHOR), Descroix, Stéphanie1,2 (AUTHOR) stephanie.descroix@curie.fr

    Source: Scientific Reports. 6/8/2022, Vol. 12 Issue 1, p1-11. 11p.

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    Academic Journal
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    Academic Journal
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    Academic Journal
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    Academic Journal
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    Academic Journal
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    Academic Journal
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