Toward TSV-Compatible Microfluidic Cooling for 3D ICs

Authors: Yan, G., Chung, E., Masselink, E., Oh, S., Zia, M., Ramakrishnan, B., Oruganti, V., Alissa, H., Belady, C., Im, Y., Joshi, Y., Bakir, M.S.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(1):104-112 Jan, 2025

Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI)

Authors: Chung, E., Yan, G., Oh, S., Ramakrishnan, B., Alissa, H., Oruganti, V., Belady, C., Bakir, M.S.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(10):1792-1802 Oct, 2024

Data Center Power and Energy Management: Past, Present, and Future

Authors: Bianchini, R., Belady, C., Sivasubramaniam, A.

Source: IEEE Micro Micro, IEEE. 44(5):30-36 Jan, 2024

Overclocking in Immersion-Cooled Datacenters

Authors: Misra, P.A., Manousakis, I., Choukse, E., Jalili, M., Goiri, I., Raniwala, A., Warrier, B., Alissa, H., Ramakrishnan, B., Tuma, P., Belady, C., Fontoura, M., Bianchini, R.

Source: IEEE Micro Micro, IEEE. 42(4):10-17 Aug, 2022

Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management

Authors: Kochupurackal Rajan, S., Ramakrishnan, B., Alissa, H., Kim, W., Belady, C., Bakir, M.S.

Source: IEEE Access Access, IEEE. 10:59259-59269 2022

CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling

Authors: Ramakrishnan, B., Alissa, H., Manousakis, I., Lankston, R., Bianchini, R., Kim, W., Baca, R., Misra, P.A., Goiri, I., Jalili, M., Raniwala, A., Warrier, B., Monroe, M., Belady, C., Shaw, M., Fontoura, M.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(10):1703-1715 Oct, 2021

Data center power projections to 2014

Authors: Belady, C., Malone, C.

Source: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :439-444 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

Thermal design methodology for electronic systems

Authors: Minichiello, A., Belady, C.

Source: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :696-704 2002

Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Cooling and power considerations for semiconductors into the next century

Authors: Belady, C.

Source: ISLPED'01: Proceedings of the 2001 International Symposium on Low Power Electronics and Design (IEEE Cat. No.01TH8581) Low power electronics and design Low Power Electronics and Design, International Symposium on, 2001.. :100-105 2001

Relation: ISLPED'01: Proceedings of the 2001 International Symposium on Low Power Electronics and Design

High heat flux and high density cooling: Its all relative

Authors: Belady, C.

Source: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:713-715 Vol.2 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

Gravity-assisted air mixing in data centers and how it affects the rack cooling effectiveness

Authors: Herrlin, M.K., Belady, C.

Source: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :5 pp.-438 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

Prometheus: A Wirelessly Interconnected, Pico-Datacenter Framework for the Developing World
Wired/wireless internet communication

Authors: Lakafosis, V., Addagatla, S., Belady, C., Sinha, S.

Source: LECTURE NOTES IN COMPUTER SCIENCE. (7277):26-39

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN082180343&indx=1&recIds=ETOCCN082180343

IPACK2005-73321 MX2 Processor Module: Twice the Processors in Half the Volume
ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS and electronic systems; Advances in electronic packaging

Authors: Belady, C., Williams, S., Harris, G.

Source: ADVANCES IN ELECTRONIC PACKAGING. (B):977-982

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN059921667&indx=1&recIds=ETOCCN059921667

Evolution of Data Center Environmental Guidelines
ASHRAE; American Society of Heating, Refrigerating and Air-Conditioning Engineers

Authors: Schmidt, R. R., Belady, C., Classen, A., Davidson, T., Herrlin, M., Novotny, S., Perry, R.

Source: TRANSACTIONS- AMERICAN SOCIETY OF HEATING, REFRIGERATING AND AIR-CONDITIONING ENGINEERS. 110(NO 1):559-566

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN052613035&indx=1&recIds=ETOCCN052613035

IPACK2003-35273 A Hybrid Methodology for the Optimization of Data Center Room Layout
International electronic packaging technical conference and exhibition; Rf microwave; telecommunications; thermal management; embedded passives; airborne; space and defense electronics systems

Authors: Guggari, S., Agonafer, D., Belady, C., Stahl, L.

Source: ADVANCES IN ELECTRONIC PACKAGING. 2:605-612

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN050871506&indx=1&recIds=ETOCCN050871506

Designing an alternative to conventional room cooling
International telecommunications energy conference

Authors: Stahl, L., Belady, C.

Source: IEE CONFERENCE PUBLICATION. (NO 484):109-115

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN043327367&indx=1&recIds=ETOCCN043327367

IPACK2001-15622 Computational Fluid Dynamics Modeling of High Compute Density Data Centers to Assure System Inlet Air Specifications
The Pacific rim/international, intersociety electronic packaging technical/business conference

Authors: Patel, C. D., Bash, C. E., Belady, C., Stahl, L., Sullivan, D.

Source: ADVANCES IN ELECTRONIC PACKAGING. :821-830

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN042459641&indx=1&recIds=ETOCCN042459641

in the data center, power and cooling costs more than the it equipment it supports

Authors: Belady, C. L.

Source: ELECTRONICS COOLING. 13(1):24-27

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN205298822&indx=1&recIds=ETOCRN205298822

508056 Power on the processor board

Authors: Belady, C., Pallotti, L. H., Peterson, E. C., Klein, D. A., Kimmel, A. T., Harris, S. L., Chastain, D. M., Haden, S. C., Wirtzberger, P. A.

Source: RESEARCH DISCLOSURE. (508):1045-1048

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN193800735&indx=1&recIds=ETOCRN193800735

Roadmap for Datacom Cooling

Authors: Belady, C. L., Beaty, D.

Source: ASHRAE JOURNAL. 47(12):52-55

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN180356563&indx=1&recIds=ETOCRN180356563