Setting the Course, but Forgetting to Steer: Analyzing Compliance with GDPR's Right of Access to Data by Instagram, TikTok, and YouTube

Authors: Karnam, Sai Keerthana, Dash, Abhisek, Mousavi, Sepehr, Bechtold, Stefan, Gummadi, Krishna P., Mukherjee, Animesh, Weber, Ingmar, Zannettou, Savvas

Subject Terms: Computer Science - Computers and Society, Computer Science - Human-Computer Interaction

Access URL: http://arxiv.org/abs/2502.11208

Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Authors: Yuan, Chengdong, Maeter, Sonke, Maniar, Youssef, Bechtold, Tamara

Source: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th. :1-6 Sep, 2024

Relation: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

Accountable Bulletin Boards: Definition and Provably Secure Implementation

Authors: Graf, Mike, Kusters, Ralf, Rausch, Daniel, Egger, Simon, Bechtold, Marvin, Flinspach, Marcel

Source: 2024 IEEE 37th Computer Security Foundations Symposium (CSF) CSF Computer Security Foundations Symposium (CSF), 2024 IEEE 37th. :201-216 Jul, 2024

Relation: 2024 IEEE 37th Computer Security Foundations Symposium (CSF)

Error Estimation and Stopping Criteria for Krylov-Based Model Order Reduction in Acoustics

Authors: Hu, Siyang, Wulbusch, Nick, Chernov, Alexey, Bechtold, Tamara

Subject Terms: Mathematics - Numerical Analysis, Electrical Engineering and Systems Science - Systems and Control, Mathematics - Dynamical Systems, 37M05, 65P99, 33J05

Access URL: http://arxiv.org/abs/2412.10559

Cutting a Wire with Non-Maximally Entangled States

Authors: Bechtold, Marvin, Barzen, Johanna, Leymann, Frank, Mandl, Alexander

Source: 2024 IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW) IPDPSW Parallel and Distributed Processing Symposium Workshops (IPDPSW), 2024 IEEE International. :1136-1145 May, 2024

Relation: 2024 IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW)

Model Order Reduction of an Electromagnetic Actuator with Moving Components via Piecewise Quadratic Coupling

Authors: Schutz, Arwed, Bechtold, Tamara

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Comparison of Model Order Reduction Methods for a Linear Finite Element Model of an Electrically Stimulated Neuron

Authors: Fitzer, Ulrike, Goyal, Pawan, Schuetz, Arwed, Zawra, Ibrahim, Hohlfeld, Dennis, Bechtold, Tamara

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Bi-directional Evolutionary Structural Optimization of Multi-Resonant MEMS

Authors: Hu, Siyang, Manansala, Billy, Bechtold, Tamara

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Efficient Simulation of Nonlinear Plastic Models in Microelectronics: A Trajectory Piecewise Linear-Based Model Order Reduction

Authors: Yuan, Chengdong, Maeter, Sonke, Schutz, Arwed, Zawra, Ibrahim, Soestbergen, Michiel van, Bechtold, Tamara

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test

Authors: Yuan, Chengdong, Niessner, Martin, Bechtold, Tamara

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

The NIRSpec Micro-Shutter Array: Operability and Operations After Two Years of JWST Science

Authors: Bechtold, Katie, Böker, Torsten, Franz, David E., Plate, Maurice te, Rawle, Timothy D., Wu, Rai, Zeidler, Peter

Subject Terms: Astrophysics - Instrumentation and Methods for Astrophysics

Access URL: http://arxiv.org/abs/2408.15940

Lawma: The Power of Specialization for Legal Tasks

Authors: Dominguez-Olmedo, Ricardo, Nanda, Vedant, Abebe, Rediet, Bechtold, Stefan, Engel, Christoph, Frankenreiter, Jens, Gummadi, Krishna, Hardt, Moritz, Livermore, Michael

Subject Terms: Computer Science - Computation and Language, Computer Science - Artificial Intelligence, Computer Science - Machine Learning

Access URL: http://arxiv.org/abs/2407.16615

Implantable Thermoelectric Generator with High Aspect Ratio Thermolegs and Integrated Voltage Converter

Authors: Rao, Yongchen, Voss, Matthias, Bechtold, Tamara, Hohlfeld, Dennis

Source: 2023 IEEE 22nd International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS) Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS), 2023 IEEE 22nd International Conference on. :206-209 Dec, 2023

Relation: 2023 IEEE 22nd International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS)

Matrix Interpolation-Based Parametric Model Order Reduction of a Miniaturized Electromagnetic Energy Harvester Model

Authors: Yuan, Chengdong, Schutz, Arwed, Hohlfeld, Dennis, Bechtold, Tamara

Source: 2023 IEEE 22nd International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS) Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS), 2023 IEEE 22nd International Conference on. :52-55 Dec, 2023

Relation: 2023 IEEE 22nd International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS)

Joint Wire Cutting with Non-Maximally Entangled States

Authors: Bechtold, Marvin, Barzen, Johanna, Leymann, Frank, Mandl, Alexander, Truger, Felix

Subject Terms: Quantum Physics

Access URL: http://arxiv.org/abs/2406.13315

On Young regimes for locally monotone SPDEs

Authors: Bechtold, Florian, Wichmann, Jörn

Subject Terms: Mathematics - Probability, Mathematics - Analysis of PDEs

Access URL: http://arxiv.org/abs/2405.01523

Architectural Vision for Quantum Computing in the Edge-Cloud Continuum

Authors: Furutanpey, Alireza, Barzen, Johanna, Bechtold, Marvin, Dustdar, Schahram, Leymann, Frank, Raith, Philipp, Truger, Felix

Source: 2023 IEEE International Conference on Quantum Software (QSW) QSW Quantum Software (QSW). 2023 IEEE International Conference on. :88-103 Jul, 2023

Relation: 2023 IEEE International Conference on Quantum Software (QSW)

In-Home Video and IMU Kinematics of Self Guided Tasks Correlate with Clinical Bradykinesia Scores

Authors: Strandquist, Gabrielle, Dixon, Tanner, Fraczek, Tomasz, Ravi, Shravanan, Zeng, Alicia, Bechtold, Raphael, Lawrence, Daryl, Little, Simon, Gallant, Jack, Herron, Jeffrey

Source: 2023 11th International IEEE/EMBS Conference on Neural Engineering (NER) Neural Engineering (NER), 2023 11th International IEEE/EMBS Conference on. :1-6 Apr, 2023

Relation: 2023 11th International IEEE/EMBS Conference on Neural Engineering (NER)

Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics

Authors: Zawra, I., Umunnakwe, C. B., Soestbergen, M. van, Rudnyi, E. B., Bechtold, T.

Source: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Towards System-level Simulation of an Electromagnetic Energy Harvester Model via Equivalent Circuit Extraction from ANSYS Maxwell 3D

Authors: Yuan, Chengdong, Hohlfeld, Dennis, Bechtold, Tamara

Source: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)