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1Academic Journal
Authors: Biswas, K., Sett, A., Mondal, M., Tripathy, S., Bandyopadhyay, J., De, D., Bhattacharyya, T.K.
Source: IEEE Transactions on NanoBioscience IEEE Trans.on Nanobioscience NanoBioscience, IEEE Transactions on. 21(2):265-272 Apr, 2022
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2Conference
Authors: Pham, N., Cases, M., Bandyopadhyay, J.
Source: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :267-271 2000
Relation: 2000 Proceedings. 50th Electronic Components and Technology Conference
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3Conference
Authors: Bandyopadhyay, J., Cases, M.
Source: IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.. :9-12 2000
Relation: IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging
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4Conference
Authors: Bandyopadhyay, J.
Source: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1999. :103-106 1999
Relation: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging
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5
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6Conference
Authors: Pannala, S., Bandyopadhyay, J., Swaminathan, M., Torres, M., Smith, L., Yuan, X., Fitzgerald, G.
Source: IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on. :185-188 1998
Relation: IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
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7Conference
Authors: Bandyopadhyay, J., Chahal, P., Swaminathan, M.
Source: Electrical Performance of Electronic Packaging Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on. :31-34 1997
Relation: Electrical Performance of Electronic Packaging
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8Academic Journal
Authors: Pannala, S., Bandyopadhyay, J., Swaminathan, M.
Source: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 22(3):249-258 Aug, 1999
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9Academic Journal
Authors: Pradyumna, S., Bandyopadhyay, J. N.
Source: Journal of Engineering Mechanics; May 2010, Vol. 136 Issue 5, p551-561, 11p
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10Academic Journal
Authors: Bandyopadhyay, J.
Source: Economic and Political Weekly, 2002 Oct 01. 37(40), 4108-4112.
Access URL: https://www.jstor.org/stable/4412689
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11Academic Journal
Authors: Nanda, Namita, Bandyopadhyay, J. N.
Source: Journal of Engineering Mechanics; November 2008, Vol. 134 Issue 11, p983-990, 8p
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12Academic Journal
Source: Journal of Engineering Mechanics; October 2006, Vol. 132 Issue 10, p1088-1095, 8p
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13Academic Journal
Authors: Nayak, A. N., Bandyopadhyay, J. N.
Source: Journal of Engineering Mechanics; January 2005, Vol. 131 Issue 1, p100-105, 6p
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14Academic Journal
Authors: Nayak, A. N., Bandyopadhyay, J. N.
Source: Journal of Engineering Mechanics; April 2002, Vol. 128 Issue 4, p419-427, 9p
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15Academic Journal
Source: Journal of Engineering Mechanics; January 1998, Vol. 124, p1-8, 8p
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16Periodical
Authors: Das, S., Sarkar, Y., Majumder, R., Mukherjee, S., Bandyopadhyay, J., Ray, A., Parui, P.
Source: NEW JOURNAL OF CHEMISTRY. 41(4):1488-1498
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17Periodical
Authors: Saadi, S. M., Mondal, I., Sarkar, S., Mondal, A. K., Bandyopadhyay, J.
Source: SPATIAL INFORMATION RESEARCH. 25(1):49-56
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18Periodical
Authors: Mondal, I., Bandyopadhyay, J., Dhara, S.
Source: SPATIAL INFORMATION RESEARCH. 25(1):67-73
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19Periodical
Authors: Maity, S., Mondal, I., Das, B., Mondal, A. K., Bandyopadhyay, J.
Source: SPATIAL INFORMATION RESEARCH. 25(1):57-66
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20Conference
Authors: Bandyopadhyay, J., Das, P.
Source: INDIAN CARTOGRAPHER. 28:409-420