Showing 1 - 20 results of 151 Refine Results
  1. 1
    Academic Journal

    Toward TSV-Compatible Microfluidic Cooling for 3D ICs

    Authors: Yan, G., Chung, E., Masselink, E., Oh, S., Zia, M., Ramakrishnan, B., Oruganti, V., Alissa, H., Belady, C., Im, Y., Joshi, Y., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(1):104-112 Jan, 2025

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  2. 2
    Academic Journal

    Heterogeneous Integration Enabled by 3-D Stitch-Chips

    Authors: Oh, S., Zhang, Z., Yan, G., Jo, P.K., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(1):113-122 Jan, 2025

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  3. 3
    Academic Journal

    Tier Transfer of Ultrathin Reconstituted- SiO₂ Chiplet Tiers

    Authors: Victor, A., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(2):432-434 Feb, 2025

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  4. 4
    Academic Journal

    Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI)

    Authors: Chung, E., Yan, G., Oh, S., Ramakrishnan, B., Alissa, H., Oruganti, V., Belady, C., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(10):1792-1802 Oct, 2024

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  5. 5
    Academic Journal

    Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology

    Authors: Zheng, T., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1172-1179 Jul, 2024

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  6. 6
    Academic Journal

    Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly

    Authors: Nieves Calderon, M.A., Oh, S., Brescia, J.R., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):529-532 Mar, 2024

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  7. 7
    Academic Journal

    Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications

    Authors: Oh, S., Zheng, T., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):202-210 Feb, 2024

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  8. 8
    Academic Journal

    Heterogeneous Integration Technologies for Artificial Intelligence Applications

    Authors: Manley, M., Victor, A., Park, H., Kaul, A., Kathaperumal, M., Bakir, M.S.

    Source: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits IEEE J. Explor. Solid-State Comput. Devices Circuits Exploratory Solid-State Computational Devices and Circuits, IEEE Journal on. 10:89-97 2024

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  9. 9
    Academic Journal

    H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention

    Authors: Li, W., Manley, M., Read, J., Kaul, A., Bakir, M.S., Yu, S.

    Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 31(10):1592-1602 Oct, 2023

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  10. 10
    Academic Journal

    Quarter-Micron Alignment of Chiplets via Positive Self-Aligned Structures

    Authors: Yu, S., Gaylord, T.K., Bakir, M.S.

    Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 35(21):1183-1185 Nov, 2023

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  11. 11
    Academic Journal

    Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules

    Authors: Zheng, T., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(7):1064-1066 Jul, 2023

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  12. 12
    Academic Journal

    3-D Heterogeneous Integration of RRAM-Based Compute-In-Memory: Impact of Integration Parameters on Inference Accuracy

    Authors: Kaul, A., Luo, Y., Peng, X., Manley, M., Yu, S., Bakir, M.S.

    Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(2):485-492 Feb, 2023

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  13. 13
    Academic Journal

    Benchmarking Frequency-Dependent Parasitics of Fine-Pitch Off-Chip I/Os for 2.5D and 3D Heterogeneous Integration

    Authors: Zheng, T., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(12):2002-2012 Dec, 2022

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  14. 14
    Academic Journal

    Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration

    Authors: Hossen, M.O., Kaul, A., Nurvitadhi, E., Pant, M.D., Gutala, R., Dasu, A., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(11):1824-1831 Nov, 2022

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  15. 15
    Academic Journal

    Fiber-Array-to-Chip Interconnections With Sub-Micron Placement Accuracy via Self-Aligning Chiplets

    Authors: Yu, S., Gaylord, T.K., Bakir, M.S.

    Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 34(19):1023-1025 Oct, 2022

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  16. 16
    Academic Journal

    Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management

    Authors: Kochupurackal Rajan, S., Ramakrishnan, B., Alissa, H., Kim, W., Belady, C., Bakir, M.S.

    Source: IEEE Access Access, IEEE. 10:59259-59269 2022

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  17. 17
    Academic Journal

    A Substrate-Agnostic, Submicrometer PSAS-to-PSAS Self-Alignment Technology for Heterogeneous Integration

    Authors: Gonzalez, J.L., Rajan, S.K., Brescia, J.R., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(12):2061-2068 Dec, 2021

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  18. 18
    Academic Journal

    A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment

    Authors: Gonzalez, J.L., Brescia, J.R., Zheng, T., Rajan, S.K., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(12):2069-2076 Dec, 2021

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  19. 19
    Academic Journal

    3-D Integrated Chiplet Encapsulation (3-D ICE): High-Density Heterogeneous Integration Using SiO2-Reconstituted Tiers

    Authors: Li, M., Bakir, M.S.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(12):2242-2245 Dec, 2021

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  20. 20
    Academic Journal

    Heterogeneous 3-D Integration of Multitier Compute-in-Memory Accelerators: An Electrical-Thermal Co-Design

    Authors: Peng, X., Kaul, A., Bakir, M.S., Yu, S.

    Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(11):5598-5605 Nov, 2021

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