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  1. 1
    Conference

    Source: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

    Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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    Conference

    Source: 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO) MICRO Microarchitecture (MICRO), 2020 53rd Annual IEEE/ACM International Symposium on. :811-824 Oct, 2020

    Relation: 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

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    Conference

    Source: 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO) MICRO Microarchitecture (MICRO), 2020 53rd Annual IEEE/ACM International Symposium on. :781-795 Oct, 2020

    Relation: 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

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    Academic Journal

    Authors: AL-RAMAHI, RAED AWAD OMAR1, RASHID, RADZUWAN AB2,3, radzuwanrashid@unisza.edu.my

    Source: 3L: Southeast Asian Journal of English Language Studies; Sep2024, Vol. 30 Issue 3, p1-17, 17p

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  17. 17
    Academic Journal

    Alternate Title: تأثير زمن النقش بحمض الهيدروفلوريك على القوة الانحنائية وخشونة السطحلمواد السيراميك المختلفة المستخدمة في الترميمات السنية.

    Authors: Awad, Omar M.1 omarmhmudaiad@gmail.com, Hameed, Mohammed R.1

    Source: Jordan Medical Journal. Mar2025, Vol. 59 Issue 1, p136-149. 14p.

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    Conference

    Source: 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems (ICECS) Electronics, Circuits, and Systems (ICECS), 2013 IEEE 20th International Conference on. :516-519 Dec, 2013

    Relation: 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems (ICECS)

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