Off-Line Evaluation of Indoor Positioning Systems in Different Scenarios: The Experiences From IPIN 2020 Competition

Authors: Potorti, F., Torres-Sospedra, J., Quezada-Gaibor, D., Jimenez, A.R., Seco, F., Perez-Navarro, A., Ortiz, M., Zhu, N., Renaudin, V., Ichikari, R., Shimomura, R., Ohta, N., Nagae, S., Kurata, T., Wei, D., Ji, X., Zhang, W., Kram, S., Stahlke, M., Mutschler, C., Crivello, A., Barsocchi, P., Girolami, M., Palumbo, F., Chen, R., Wu, Y., Li, W., Yu, Y., Xu, S., Huang, L., Liu, T., Kuang, J., Niu, X., Yoshida, T., Nagata, Y., Fukushima, Y., Fukatani, N., Hayashida, N., Asai, Y., Urano, K., Ge, W., Lee, N., Fang, S., Jie, Y., Young, S., Chien, Y., Yu, C., Ma, C., Wu, B., Wang, Y., Fan, Y., Poslad, S., Selviah, D.R., Wang, W., Yuan, H., Yonamoto, Y., Yamaguchi, M., Kaichi, T., Zhou, B., Liu, X., Gu, Z., Yang, C., Wu, Z., Xie, D., Huang, C., Zheng, L., Peng, A., Jin, G., Wang, Q., Luo, H., Xiong, H., Bao, L., Zhang, P., Zhao, F., Hung, C., Antsfeld, L., Chidlovskii, B., Jiang, H., Xia, M., Yan, D., Li, Y., Dong, Y., Silva, I., Pendao, C., Meneses, F., Nicolau, M.J., Costa, A., Moreira, A., De Cock, C., Plets, D., Opiela, M., Dzama, J., Zhang, L., Li, H., Chen, B., Liu, Y., Yean, S., Lim, B.Z., Teo, W.J., Lee, B.S., Oh, H.L.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(6):5011-5054 Mar, 2022

Magnetic Levitation Force and Torque Analysis of A Diamagnetic Material Using Nodal Force Method

Authors: Yamaguchi, T., Kawase, Y., Onogi, W., Ota, T., Asai, Y.

Source: 2020 23rd International Conference on Electrical Machines and Systems (ICEMS) Electrical Machines and Systems (ICEMS), 2020 23rd International Conference on. :1882-1887 Nov, 2020

Relation: 2020 23rd International Conference on Electrical Machines and Systems (ICEMS)

650 Volt GaN: Highest Quality-Highest Performance Drives Market Ramp

Authors: Parikh, P., Wu, Y-F., Shen, L., Gritters, J., Hosoda, T., Barr, R., Smith, K., Shono, K., McKay, J., Clement, H., Chowdhury, S., Yea, S., Smith, P., McCarthy, L., Birkhahn, R., Zuk, P., Asai, Y.

Source: 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2018 IEEE. :239-242 Oct, 2018

Relation: 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

Proactive Received Power Prediction Using Machine Learning and Depth Images for mmWave Networks

Authors: Nishio, T., Okamoto, H., Nakashima, K., Koda, Y., Yamamoto, K., Morikura, M., Asai, Y., Miyatake, R.

Source: IEEE Journal on Selected Areas in Communications IEEE J. Select. Areas Commun. Selected Areas in Communications, IEEE Journal on. 37(11):2413-2427 Nov, 2019

Evaluation of hydrogen embrittlement in ODS-Cu, Cu–Cr–Zr, and Cu–Cr alloys using slow strain rate technique test

Authors: Hatakeyama, M., Asai, Y., Nakato, D., Nishimura, M., Hatano, Y., Sunada, S., Sato, K.

Source: In Nuclear Materials and Energy March 2024 38

Construction and Evaluation of a Protocol to Support the Prescription of Glucagon Nasal Powder during Educational Hospitalization in Patients with Diabetes —Psychological Effects of Glucagon Nasal Powder in Patients at Risk of Developing Devere Hypoglycemia—

Authors: Yamamoto, T., Ando, K., Asai, Y., Muneyoshi, Y., Ida, S., Goto, H., Sato, Y., Tanaka, T.

Source: Iryō-yakugaku. 49(3):77-87

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN632748412&indx=1&recIds=ETOCRN632748412

650 V Highly Reliable GaN HEMTs on Si Substrates over Multiple Generations: Matching Silicon CMOS Manufacturing Metrics and Process Control

Authors: Chowdhury, S., Wu, Y., Shen, L., Smith, K., Smith, P., Kikkawa, T., Gritters, J., McCarthy, L., Lal, R., Barr, R., Wang, Z., Mishra, U., Parikh, P., Hosoda, T., Shono, K., Imanishi, K., Ogino, T., Mochizuki, A., Kiuchi, K., Asai, Y.

Source: 2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) Compound Semiconductor Integrated Circuit Symposium (CSICS), 2016 IEEE. :1-4 Oct, 2016

Relation: 2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

A Questionnaire Survey on the Current Status of Cooperation betwen Community Pharmacies and Hospitals in Perioperative Management in Mie Prefecture

Authors: Asai, Y., Takai, Y., Miyake, T., Morikawa, Y., Murasaka, T., Nakagawa, Y., Kanayama, T., Abe, Y., Masuda, N., Takamura, Y.

Source: Iryō-yakugaku. 48(9):368-378

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN630515255&indx=1&recIds=ETOCRN630515255

Novel method for evaluating spatial resolution of magnetic resonance images

Authors: Takeuchi, T., Hayashi, N., Asai, Y., Kayaoka, Y., Yoshida, K.

Source: Physical and engineering sciences in medicine. 45(2):487-496

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN629754920&indx=1&recIds=ETOCRN629754920

PID feedback control method for Linear Resonant Actuator using an estimated external load from the back-EMF as a target voltage

Authors: Asai, Y., Hirata, K., Ota, T.

Source: International Symposium on Power Electronics Power Electronics, Electrical Drives, Automation and Motion Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM), 2012 International Symposium on. :1547-1551 Jun, 2012

Relation: 2012 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM 2012)

Relationship Between Age-Related Spinopelvic Sagittal Alignment and Low Back Pain in Adults of Population-Based Cohorts: The ROAD Study

Authors: Asai Y, Tsutsui S, Yoshimura N, Hashizume H, Iidaka T, Horii C, Kawaguchi H, Nakamura K, Tanaka S, Yoshida M, Yamada H

Source: Journal of Pain Research, Vol Volume 15, Pp 33-38 (2022)

Subject Terms: adult spinal deformity, spinopelvic sagittal alignment, low back pain, population-based cohort, Medicine (General), R5-920

File Description: electronic resource

Relation: https://www.dovepress.com/relationship-between-age-related-spinopelvic-sagittal-alignment-and-lo-peer-reviewed-fulltext-article-JPR; https://doaj.org/toc/1178-7090

Access URL: https://doaj.org/article/29b00d7f42e44d0b869ac53503f9898b

GaN Power Commercialization with Highest Quality-Highest Reliability 650V HEMTs-Requirements, Successes and Challenges

Authors: Parikh, P., Wu, Y., Shen, L., Barr, R., Chowdhury, S., Gritters, J., Yea, S., Smith, P., McCarthy, L., Birkhahn, R., Moore, M., McKay, J., Clement, H., Mishra, U., Lal, R., Zuk, P., Hosoda, T., Shono, K., Imanishi, K., Asai, Y.

Source: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :19.7.1-19.7.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

Accelerating ODE-Based Simulation of General and Heterogeneous Biophysical Models Using a GPU

Authors: Okuyama, T., Okita, M., Abe, T., Asai, Y., Kitano, H., Nomura, T., Hagihara, K.

Source: IEEE Transactions on Parallel and Distributed Systems IEEE Trans. Parallel Distrib. Syst. Parallel and Distributed Systems, IEEE Transactions on. 25(8):1966-1975 Aug, 2014

Fast Algorithm for Decision Feedback Equalization in Multiple Input Multiple Output Channel

Authors: Wenjie Jiang, Asai, Y., Onizawa, T., Aikawa, S.

Source: 2006 IEEE 63rd Vehicular Technology Conference Vehicular Technology Conference, 2006. VTC 2006-Spring. IEEE 63rd. 5:2423-2428 2006

Relation: 2006 IEEE 63rd Vehicular Technology Conference

Experimental Evaluation of Eigenbeam MIMO-OFDM Implemented in FPGA for Wireless LAN

Authors: Onizawa, T., Ohta, A., Asai, Y., Aikawa, S.

Source: 2006 IEEE 63rd Vehicular Technology Conference Vehicular Technology Conference, 2006. VTC 2006-Spring. IEEE 63rd. 4:1782-1786 2006

Relation: 2006 IEEE 63rd Vehicular Technology Conference

Development of 13-V, 5000-ADC Power Supply with High-Frequency Transformer Coupling Applied to Electric Furnace

Authors: Noguchi, T., Nishiyama, K., Asai, Y., Matsubara, T.

Source: 2005 International Conference on Power Electronics and Drives Systems Wireless Pervasive Computing Power Electronics and Drives Systems, 2005. PEDS 2005. International Conference on. 2:1474-1479 2005

Relation: International Symposium on Wireless Pervasive Computing 2006

Translation of an adnominal construction in Japanese-Chinese machine translation - Japanese "no" and Chinese "de"

Authors: Bu, Z., Asai, Y., Uno, S., Ikeda, T.

Source: 2005 International Conference on Natural Language Processing and Knowledge Engineering Natural Language Processing and Knowledge Engineering Natural Language Processing and Knowledge Engineering, 2005. IEEE NLP-KE '05. Proceedings of 2005 IEEE International Conference on. :410-415 2005

Relation: Proceedings of the 2005 12th IEEE International Conference on Natural Language Processing and Knowledge Engineering (IEEE NLP-KE '05)

A new synchronization scheme for packet mode OFDM-SDM signals in wireless LAN

Authors: Onizawa, T., Fujita, T., Asai, Y., Uchida, D., Ohta, A., Aikawa, S.

Source: VTC-2005-Fall. 2005 IEEE 62nd Vehicular Technology Conference, 2005. Vehicular Technology Conference, 2005. VTC-2005-Fall. 2005 IEEE 62nd. 2:1021-1025 2005

Relation: VTC 2005 Fall - 2005 IEEE 62nd Vehicular Technology Conference

Inter-eigenbeam interleaving scheme for eigenbeamspace division multiplexing in OFDM system

Authors: Uchida, D., Fujita, T., Kagami, O., Umehira, M., Ohta, A., Asai, Y.

Source: VTC-2005-Fall. 2005 IEEE 62nd Vehicular Technology Conference, 2005. Vehicular Technology Conference, 2005. VTC-2005-Fall. 2005 IEEE 62nd. 1:578-582 2005

Relation: VTC 2005 Fall - 2005 IEEE 62nd Vehicular Technology Conference

The effect of Ta oxygen scavenger layer on HfO$_2$-based resistive switching behavior: thermodynamic stability, electronic structure, and low-bias transport

Authors: Zhong, X., Rungger, I., Zapol, P., Nakamura, H., Asai, Y., Heinonen, O.

Subject Terms: Condensed Matter - Mesoscale and Nanoscale Physics, Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/1602.06793