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  1. 1
    Academic Journal

    Authors: Šolić, Tomislav1, dmaric@unisb.hrtsolic@unisb.hr, Marić, Dejan1, ivan.samardzic@unisb.hr, Peko, Ivan2, tsolic@unisb.hr, Samardžić, Ivan1

    Source: Applied Sciences (2076-3417); Jan2025, Vol. 15 Issue 2, p673, 16p

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    Academic Journal

    Authors: Zegang Sun1, szg527@126.com, Zhonghao Zheng1, zzhkaoyan@163.com, Jiabin Zhang1, 18828923740@163.com, Fan Zhao1, zf18035360952@163.com

    Source: Journal of Vibroengineering; Nov2024, Vol. 26 Issue 7, p1714-1729, 16p

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    Academic Journal

    Authors: Du, Yonglong1, yonglong@shu.edu.cn, Liu, Xin2, liuxin5@shanghai-electric.com, Xu, Songzhe1, cchen1@shu.edu.cnsongzhex@shu.edu.cn, Fan, Enxiang2, songzhex@shu.edu.cnzhaolx3@shanghai-electric.com, Zhao, Lixiao2, Chen, Chaoyue1, zmren@shu.edu.cn, Ren, Zhongming1

    Source: Metals (2075-4701); Oct2024, Vol. 14 Issue 10, p1124, 18p

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  6. 6
    Academic Journal

    Authors: Chen, Haihong1, Zhao, Shilong1, zhaoshilong@mail.sysu.edu.cn

    Source: Applied Sciences (2076-3417); Oct2024, Vol. 14 Issue 19, p8979, 13p

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    Academic Journal

    Authors: Wang, Yanan1, wang-yanan@dhu.edu.cn, Cui, Zhitong2, Gong, Hebo2, Chen, Ting2

    Source: International Journal of Human-Computer Interaction; Aug2024, Vol. 40 Issue 16, p4392-4411, 20p

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  11. 11
    Academic Journal

    Authors: Dai, Pan1, 18323927017@163.comdaipanviola@163.com, Chen, Runjie1, moring0215@163.com, Luo, Xian2, daipanviola@163.comsummer23acc@163.com, Yang, Lin2, Wen, Lei3, wenlei@ustb.edu.cn, Tu, Tao4, tutaomgm@126.com, Wang, Chen1, wwzhao@xsyu.edu.cn, Zhao, Wenwen1, lxhong71@sina.com.cn, Lv, Xianghong1

    Source: Coatings (2079-6412); Jun2024, Vol. 14 Issue 6, p737, 16p

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  12. 12
    Academic Journal

    Authors: Wang, Jun1, alps5627@163.com, Jia, Dongzhou1,2, jia_dongzhou@163.comlvzl2002@xaut.edu.cn, Yang, Min3, 18266487809@163.com, Zhang, Yanbin3, zhangyanbin1_qdlg@163.com, Qu, Da4, qd007@cqut.edu.cn, Lv, Zhenlin2

    Source: Coatings (2079-6412); Jun2024, Vol. 14 Issue 6, p676, 28p

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    Conference

    Authors: Al-Khafajy, Duaa S.1 (AUTHOR) mae.21.008@grad.uotechnology.edu.iq, Al-Kaisy, Hanaa A.1 (AUTHOR) 130011@uotechnology.edu.iq, Al-Shroofy, Mohanad N.1 (AUTHOR) 10769@uotechnology.edu.iq

    Source: AIP Conference Proceedings. 2025, Vol. 3169 Issue 1, p1-10. 10p.

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  17. 17
    Academic Journal

    Source: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 37(4):576-582 Nov, 2024

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  18. 18
    Conference

    Source: 2024 18th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA) Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), 2024 18th Symposium on. :615-619 Nov, 2024

    Relation: 2024 18th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA)

  19. 19
    Conference

    Source: 2024 18th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA) Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), 2024 18th Symposium on. :645-648 Nov, 2024

    Relation: 2024 18th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA)

  20. 20
    Conference

    Source: 2024 18th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA) Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), 2024 18th Symposium on. :177-181 Nov, 2024

    Relation: 2024 18th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA)